Fan-Out Wafer-Level Packaging And Copper Electrodeposition


By Steven T. Mayer, Bryan Buckalew, and Kari Thorkelsson As integrated circuit designers bring more sophisticated chip functionality into smaller spaces, heterogeneous integration, including 3D stacking of devices, becomes an increasingly useful and cost-effective way of mixing and connecting various functional technologies. One of the heterogeneous integration platforms gaining increased ac... » read more

Artificial Intelligence Is Everywhere


It’s pretty hard to talk about technology today without artificial intelligence, or AI, entering into the conversation. It seems to be everywhere… and growing. Businesses are using it to operate more efficiently, it’s resulting in safer and more useful products, and it has the promise of allowing us to personalize our worlds as devices learn our preferences. The age of AI AI refers to t... » read more

Big Problems In A Little Data World


Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor industry. Titled “I’m Living in a Little Data World, but I Have a Big Problem,” Rick talked about the challenges faced by the “little data world” of process development and the potential for ... » read more

Using New Technologies On Smaller Wafers


The industry is no longer held captive by sales from computing applications, such as personal computers, servers or even cellular phones and tablets. A diverse range of markets are contributing to growth seen by Lam and our customers. Cloud storage, machine learning or artificial intelligence (AI), virtual reality (VR) and augmented reality (AR), robotics, medical and automotive, including the ... » read more

Weighing Wafers Simplifies Metrology


Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the yield to decrease. For this reason, it has always been important to measure and monitor the most critical process steps to ensure that no further processing is done on a faulty lot and so that equipme... » read more

Scaling Up And Down


You don’t have to look very far in the semiconductor world before you see the word “scaling.” Perhaps you read an industry news article headline about transistor scaling – how those nearly nanoscale components are shrinking even smaller in size down to the atomic scale. Or maybe you heard a reference to memory capacity scaling – how our favorite mobile devices can store more high-reso... » read more

From Sand To Wafers


More than most industries, ours is identified with a single element, silicon. Consider the self-adopted naming conventions of all the places that want to be recognized as members of the club—Silicon Valley, Silicon Beach, Silicon Forest and so on. Silicon wafers are fundamental in manufacturing the electronic “chips” that pervade almost every aspect of our lives. New applications in IoT, ... » read more

Industry 4.0: The Smart Industrial Revolution


As consumers, we see evidence of the Internet of Things (IoT) all around us. A growing number of everyday objects in our homes and cars are now digitally connected in a way that allows us to interact with them. Even mundane items such as keychains and wallets can be made smart with trackers and mobile device apps. A similar revolution is occurring in some workplaces, with the growing ability to... » read more

Semiconductors In Automotive


It was more than 130 years ago in 1885 when Gottlieb Daimler invented the first prototype for the modern gas engine, and in 1886 Karl Benz patented his three-wheel Benz Motor Car, Model No. 1. Yet even these visionaries might have been surprised by the sophisticated technology running our cars today – and they couldn’t even have imagined the vast range of semiconductor components involved. ... » read more

Etch Techniques for Next-Generation Storage-Class Memory


Chipmakers make abundant use of two very different functional classes of memory in their products. For operational use (main/primary memory) where speed is critical, DRAM and SRAM are employed, whereas for long-term storage, flash memory – in particular NAND – provides the high capacity at low cost needed. For both classes, efforts to improve speed, capacity, and power usage are ongoing. To... » read more

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