category: Blogs – MD

category: IoT, Security & Automotive

Using Glass As A Dielectric In Electronic Packaging
By Dick Otte - 20 Mar, 2025 - Comments: 0

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry experimentation with alternative materials. To this end, glass substrates have emerged as a promising alternative with distinct benefits for semiconductor packaging. Major chipmakers, including ... » read more

Four Things Every Engineer Should Know About PFAS
By Jessica Albright - 20 Mar, 2025 - Comments: 0

What are PFAS chemicals? “PFAS” is an acronym for per- and polyfluoroalkyl substances. These man-made chemicals migrate into soil, water, and air when produced and used. There are many ways humans come in contact with PFAS, such as in non-stick cookware or cosmetics, but by far the most significant impact on human health is when PFAS is consumed in drinking water. Exposure to PFAS may resu... » read more

AI And Semiconductor In Reciprocity
By Mike Hung - 20 Mar, 2025 - Comments: 0

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while AI applications create new semiconductor demands and drive the development of semiconductor technologies, with both complementing each other. Semiconductor packaging: The bridge between chip an... » read more

Sustainable AI Systems For Energy-Efficient Computing
By Pushkar Apte - 20 Mar, 2025 - Comments: 0

By Pushkar Apte, Jim Sexton, and Melissa Grupen-Shemansky The world is abuzz with the new opportunities being created by artificial intelligence (AI), enabled by the availability of unprecedented amounts of data. AI runs on the semiconductor engine, and in turn, creates a rising demand for semiconductor chips. The semiconductor industry is predicted to reach $1 trillion in revenue by 2030 ... » read more

Back-End Packaging And Test: From Lessons Learned To Future Innovations
By Jessica Albright - 20 Feb, 2025 - Comments: 0

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating microscopic electronic circuits on a silicon wafer. Packaging an... » read more

Energy Saving In Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization
By Arieff Yusoff - 20 Feb, 2025 - Comments: 0

In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals for semiconductor manufacturing processes. These alternatives aim to minimize hazards while promoting greater sustainability. Notably, this trend extends to exploring substitutes for conventional c... » read more

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs
By Thuc Dam - 20 Feb, 2025 - Comments: 0

There are so many challenges in producing modern semiconductor devices that it’s amazing for the industry to pull it off at all. From the underlying physics to fabrication processes to the development flow, there is no shortage of tough issues to address. Some of the biggest arise in lithography for deep submicron chips. A recent post outlined the major trends in lithography and summarized a ... » read more

Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
By Vincent Lin - 20 Feb, 2025 - Comments: 0

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Tod... » read more

Mechanical Stress In Semiconductor Development
By Ivan Chakarov - 20 Feb, 2025 - Comments: 0

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks,1 mechanical failures may become more common. Due to the complexity of these structures, mechanical stress from materials processing has the potential to significantly impact yield. 3D processing techniques (etching, deposition, and related chemistries), as well as material property de... » read more

Developing Systems For Heterogeneous Integration: Insights From HiCONNECTS
By Kartikey Srivistava - 20 Feb, 2025 - Comments: 0

The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funde... » read more

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