Streamlining Interconnect Integration Accelerates Globally Distributed Design

By Kurt Shuler - 26 Feb, 2015 - Comments: 0

As system on chip designs grow more complex, it becomes more and more difficult for chip companies to optimize the work of their distributed design teams. While each separate team has an area of expertise and sets their focus on a particular aspect of the SoC, the hard part comes in integrating these individual design efforts together. When something goes wrong and it doesn’t work, the compan... » read more

The ABCs Of ISO 26262

By Kurt Shuler - 18 Dec, 2014 - Comments: 2

Over the last one-and-a-half years that I have been elbow-deep working on the FlexNoC Resilience Package, I’ve been keeping a running list of ISO 26262 abbreviations and acronyms that reoccurred in my work, and kept confusing me whenever I performed a “context switch” from working on different projects to working on my functional safety products. I’ve received feedback that my list is h... » read more

A Primer On ISO 26262 Certification

By Kurt Shuler - 29 Oct, 2014 - Comments: 0

As the electronic processing capabilities of the average car increases, more and more software, semiconductor, and semiconductor IP companies are trying to enter the automotive electronics market. Many of these new entrants have strong backgrounds in consumer electronics or the PC industry, and are new to the unique requirements of the automotive market. The purpose of this article is to pro... » read more

‘Hardening’ SoCs For Automotive Market Challenges

By Kurt Shuler - 26 Sep, 2014 - Comments: 0

The semiconductor is enamored with the automotive, industrial and medical markets, and many companies are now shifting their focus there. But many mainstream vendors will face challenges entering this market. For those who have traditionally participated in the smart phone or mobility market, I will outline some changes they need to consider to successfully compete in these emerging spaces. ... » read more

NoC Technology: Saving the Planet, One Chip at a Time

By Kurt Shuler - 21 Aug, 2014 - Comments: 0

In Silicon Valley, the cliché is that we are using technology to change the world in some meaningful way. However, I made some calculations recently and I found network-on-chip technology is actually contributing to efforts to reduce carbon emissions. SoC designers have become the ultimate energy misers as they strive to make tradeoffs between extending battery life and providing game-chang... » read more

Apple CarPlay Vs. Android Auto

By Kurt Shuler - 25 Jul, 2014 - Comments: 1

The smartphone wars have been fought and won (well, at least for now), but now there’s a new electronics battle brewing in your garage, rather than your pocket. The talk of smartphone SoC technology proliferating from phones and into cars has finally transformed into action, and major electronics companies are striking deals with established automobile manufacturers to integrate the benefi... » read more

3 Challenges Of Delivering Configurable Semiconductor IP

By Kurt Shuler - 26 Jun, 2014 - Comments: 0

Over time, commercial IP products have morphed from single function blocks to 100% configurable IPs where no two instances are the same. In this article I point out the challenges of creating configurable IP, and the best-known practices to address them. IP Configurability Spectrum Throughout the history of chip design, there has been a spectrum of configurability that has been built into i... » read more

SoC Assembly And IP Reuse

By Kurt Shuler - 24 Apr, 2014 - Comments: 2

I had the honor and opportunity to present at the 2014 Electronic Design Process Symposium in Monterey last Friday. This annual workshop is run by the IEEE Computer Society of Silicon Valley and the IEEE Council on Electronic Design Automation. There were more than 30 participants each day. Most of them very experienced people with lots of technical and business responsibilities. It was ... » read more

Malaysia Airlines Flight MH370 And The Progress of Technology

By Kurt Shuler - 31 Mar, 2014 - Comments: 1

Cable news has been continuously deluging us with lots of speculation regarding the fate of Malaysia Airlines flight 370. Most of us are drowning in a sea of jargon as TV talking heads express incredulity that, “with all our modern technology, a plane disappeared…” Although the disappearance of flight MH370 is a terrible tragedy, I see the larger context of our progress in commercial a... » read more

Time to mend the EE / CS divide

By Kurt Shuler - 27 Feb, 2014 - Comments: 0

There’s been a lot of news out the last few weeks about the future of our industry, and although these news flashes may seem unrelated, they are quite correlated. First, there was the disturbing news in Mark LaPedus’ article here on Semiconductor Engineering, “EUV Suffers New Setback,” portending a rough ride for the commercialization of EUV lithography. EUV will be needed to create ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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