Chip Industry Week In Review


The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

EDA Revenue Up, China Weak


EDA and hardware IP revenue grew 14.4% to $4.522 billion in Q1, extending a streak that began several years ago with unabated double-digit growth. But the upbeat report masked a sharp sales drop in China for reasons that have yet to be determined. Revenue in the overall Asia/Pacific region grew a healthy 19% YoY, while China was -6.3%. The negative impact was offset by new strength in India,... » read more

Intel Vs. Samsung Vs. TSMC


The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Chip Industry Week In Review


The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Startup Funding: Q2 2024


AI drew more investors to the chip industry in Q2. Four AI-focused chip startups receiving rounds of more than $100 million, targeting data center ASICs for transformers, highly flexible platforms for the embedded edge, dataflow processors, and mixed-signal neuromorphic chips. In-memory computing also helped boost AI, with three companies either incorporating it into their chips or providing sp... » read more

Chip Industry Week In Review


Early version due to U.S. holiday. The U.S. government announced a new $504 million funding round for 12 Regional Technology and Innovation Hubs (Tech Hubs) for semiconductors, clean energy, biotechnology, AI, quantum computing, and more. Among the recipients: NY SMART I-Corridor Tech Hub (New York): $40 million for semiconductor manufacturing; Headwaters Hub (Montana): $41 million f... » read more

Chip Industry Week In Review


The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

U.S. Proposes Restrictions On Tech Investments In China


The U.S. proposed new regulations to curtail American investments in Chinese technologies that pose a national security threat, specifically calling out semiconductors and microelectronics, quantum information technologies, and AI. The draft regulations come nearly a year after the Biden administration issued an executive order prohibiting investments in sensitive technologies used to accele... » read more

Chip Industry Week In Review


BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

← Older posts Newer posts →