category: Low Power-High Performance

category: IoT, Security & Automotive

Variability Becoming More Problematic, More Diverse
By Karen Heyman - 12 Dec, 2022 - Comments: 0

Process variability is becoming more problematic as transistor density increases, both in planar chips and in heterogeneous advanced packages. On the basis of sheer numbers, there are many more things that can wrong. “If you have a chip with 50 billion transistors, then there are 50 places where a one-in-a-billion event can happen,” said Rob Aitken, a Synopsys fellow. And if Intel’s... » read more

Ready, Set, Go: Outrunning Moore’s Law With 3D-IC
By Tony Mastroianni - 08 Dec, 2022 - Comments: 0

By Anthony Mastroianni and Gordon Allan, Siemens EDA 3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third dimension. Although far from mainstream, 3D IC’s time is coming, as chiplet standardization efforts and supporting tool developments begin to make 3D IC practicable and profitable to more players – big and small – and products w... » read more

Edge AI And Chiplets
By Andy Heinig - 08 Dec, 2022 - Comments: 0

In the near future, more edge artificial intelligence (AI) solutions will find their way into our lives. This will be especially true in the private sector for applications in the field of voice input and analysis of camera data, which will become well-established. These application areas require powerful AI hardware to be able to process the corresponding continuously accumulating data volumes... » read more

IC Stresses Affect Reliability At Advanced Nodes
By Ann Mutschler - 08 Dec, 2022 - Comments: 1

Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together for safety- and mission-critical applications. The causes of stress are numerous. In heterogeneous packages, it can stem from multiple components composed of different materials. “These materia... » read more

Boosting Data Center Memory Performance In The Zettabyte Era With HBM3
By Frank Ferro - 08 Dec, 2022 - Comments: 0

We are living in the Zettabyte era, a term first coined by Cisco. Most of the world’s data has been created over the past few years and it is not set to slow down any time soon. Data has become not just big, but enormous! In fact, according to the IDC Global Datasphere 2022-2026 Forecast, the amount of data generated over the next 5 years will be at least 2x the amount of data generated over ... » read more

Challenges With Adaptive Control
By Brian Bailey - 08 Dec, 2022 - Comments: 0

Historically, the performance and power consumption of a system was controlled by what could be done at design time, but chips today are becoming a lot more adaptive. This has become a necessity for cutting edge nodes, but also provides a lot of additional benefits at the expense of greater complexity and verification challenges. Design margins are a tradeoff between performance and yield. C... » read more

Don’t Let Your ML Accelerator Vendor Tell You The ‘F-Word’
By Steve Roddy - 08 Dec, 2022 - Comments: 0

Machine learning (ML) inference in devices is all the rage. Nearly every new system on chip (SoC) design start for mobile phones, tablets, smart security cameras, automotive applications, wireless systems, and more has a requirement for a hefty amount of ML capability on-chip. That has silicon design teams scrambling to find ML processing power to add to the existing menu of processing engines ... » read more

Improving Chip Efficiency, Reliability, And Adaptability
By Ed Sperling - 08 Dec, 2022 - Comments: 0

Peter Schneider, director of Fraunhofer Institute for Integrated Circuits' Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about new models and approaches for ensuring the integrity and responsiveness of systems, and how this can be done within a given power budget and at various speeds. What follows are excerpts of that conversation. SE: Where are y... » read more

Bridging The Digital Divide With Ultra Low-Cost Smartphones
By Neil Fletcher - 08 Dec, 2022 - Comments: 0

According to the Alliance for Affordable Internet, 2.5 billion people in emerging economies now have access to mobile broadband coverage, but many still cannot afford the typical smartphone. They need a device that hits the right price point, and also provides the right capabilities to support and enhance them in their daily lives. Despite greater connectivity, hitting this ‘smartphone sweet... » read more

Ensuring Signal And Power Integrity In Today’s High-Speed Designs
By Pavani Jella - 08 Dec, 2022 - Comments: 0

Leading-edge chip desiLeading-edge chip design was never easy, but it’s getting harder all the time. Rapid advances in communication systems are driving data rates higher. With the emergence of artificial intelligence (AI) applications and the increased need for data processing, high quality data transfer is increasingly critical. Faster data rates and more complex protocols are exacerbating ... » read more

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