Coming In Hot: Requirements For Successful Thermal Management In 3D-IC


As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often the number one limiting factor in 3D-IC design. High-speed chips stacked close together in a small housing cause things to heat up fast. One of the most common designer responses to overheating ... » read more

Research Bits: Sept. 27


Microchip detects antibodies with drop of blood A microchip developed by researchers at Georgia Tech and Emory University can detect antibodies in the blood with just a drop a blood. Postdoctoral fellow Neda Rafat and Assistant Professor Aniruddh Sarkar created a chip that uses electrical conductivity to detect antibodies using silver in the wells of the chip. When the blood reacts with silver... » read more

How Memory Design Optimizes System Performance


Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

Research Bits: Sept. 20


Multi-mode memristors Researchers from ETH Zurich, the University of Zurich, and Empa built a new memristor that can operate in multiple modes and could potentially be used to mimic neurons in more applications. “There are different operation modes for memristors, and it is advantageous to be able to use all these modes depending on an artificial neural network’s architecture,” said R... » read more

Recipe To Catch Bugs Faster Using Machine Learning


We all agree that verification and debug take up a significant amount of time and are arguably the most challenging parts of chip development. Simulator performance has consistently topped the charts and is a critical component in the verification process. Still, the need of the hour is to stretch beyond simulator speed to achieve maximum verification throughput and efficiency. Artificial in... » read more

Minimizing EM/IR Impacts On IC Design Reliability And Performance


By Joel Mercier and Karen Chow As technologies and foundry process nodes continue to advance, it gets more difficult to design and verify integrated circuits (ICs). The challenges become even more apparent in 5nm and below nodes, and as the industry moves away from fin field-effect transistor (finFET) and into gate-all-around field-effect transistor (GAAFET) technologies. There are many prob... » read more

What Is UCIe?


The semiconductor industry is undertaking a major strategy shift towards multi-die systems. The shift is fueled by several converging trends: Size of monolithic SoCs is becoming too big for manufacturability Some SoC functionalities may require different process nodes for optimal implementation Desire for enhanced product scalability and composability is increasing Multi-die syste... » read more

Microelectronics For Quantum Technologies


By Kay-Uwe Giering and Andy Heinig The transition of the quantum mechanics realm into engineering applications is opening up a large number of disruptive quantum technological opportunities. Their success relies on the recent technological advancements, which enable the controlled creation of individual quantum mechanical systems as well as their direct manipulation and measurement. Quantum ... » read more

Rethinking Machine Learning For Power


The power consumed by machine learning is exploding, and while advances are being made in reducing the power consumed by them, model sizes and training sets are increasing even faster. Even with the introduction of fabrication technology advances, specialized architectures, and the application of optimization techniques, the trend is disturbing. Couple that with the explosion in edge devices... » read more

Video Compression And Forward Error Correction On Display Interfaces


To wrap up our recent series of articles on VESA video compression codecs, this month we will look at the use of video compression on digital display interfaces, using the DisplayPort 1.4 standard as an example. DisplayPort (DP) 1.4 was released in 2016, and this was the first display interface standard for external displays to include support for VESA Display Stream Compression (DSC), a vis... » read more

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