category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

The Week In Review: Manufacturing
By Mark LaPedus - 11 Mar, 2016 - Comments: 0

In a surprising move, Intel is quietly in the process of acquiring IMS Nanofabrication, a developer of multi-beam e-beam tools for mask writing applications, Semiconductor Engineering has learned. With the deal, Intel is moving into uncharted territory by buying a semiconductor equipment company. In the past, though, the chip giant has invested in equipment vendors, such as ASML, Nikon and... » read more

Manufacturing Bits: March 8
By Mark LaPedus - 08 Mar, 2016 - Comments: 1

5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

7nm Lithography Choices
By Mark LaPedus - 07 Mar, 2016 - Comments: 2

Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm. Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 04 Mar, 2016 - Comments: 0

Is robotics the next big thing? IDC forecasts that global spending on robotics and related services will grow at a compound annual growth rate (CAGR) of 17% from more than $71 billion in 2015 to $135.4 billion in 2019. "Robotics is one of the core technologies that is enabling significant change in manufacturing through factory of the future initiatives. While traditionally used in the automoti... » read more

Manufacturing Bits: March 1
By Mark LaPedus - 01 Mar, 2016 - Comments: 0

Gravitational-wave observatories India has approved the construction of the world’s third gravitational-wave observatory. This facility will replicate the two Laser Interferometer Gravitational-wave Observatories (LIGOs) in the United States, which recently detected the world's first gravitational waves. The Indian project, dubbed LIGO-India, is expected to go online in 2023. The effort b... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Feb, 2016 - Comments: 0

What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

What’s Next For DRAM?
By Mark LaPedus - 24 Feb, 2016 - Comments: 2

The DRAM business has always been challenging. Over the years, DRAM suppliers have experienced a number of boom and bust cycles in a competitive landscape. But now, the industry faces a cloudy, if not an uncertain, future. On one front, for example, [getkc id="93" kc_name="DRAM"] vendors face a downturn amid a capacity glut and falling product prices in 2016. But despite the business chal... » read more

Manufacturing Bits: Feb. 23
By Mark LaPedus - 23 Feb, 2016 - Comments: 1

EUV resist venture JSR and Imec have signed a deal to form a joint venture to develop resists for extreme ultraviolet (EUV) lithography. The new company, dubbed EUV Resist Manufacturing & Qualification Center NV, is incorporated with a majority of the total shares held by JSR Micro NV. As EUV technology advances, the IC industry is putting pressure on materials suppliers and other vendo... » read more

How Healthy Is The Chip Market?
By Ed Sperling - 22 Feb, 2016 - Comments: 1

By Ed Sperling & Ann Steffora Mutschler The inclusion of semiconductors in more products across more market segments—many of which historically have not been large consumers of chips—is having a big impact on how they are designed and manufactured, as well as how they are tracked and quantified. In the past, semiconductor sales were so closely tied to the success of personal computers... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Feb, 2016 - Comments: 0

The SPIE Advanced Lithography conference is next week. “The conference should provide an update on extreme ultraviolet lithography (EUV) sentiment from chipmakers such as Intel and TSMC, and we expect generally positive sentiment, which should be good for ASML. Still, high-volume adoption timing of EUV appears to be in the 2020 time frame, so it's very early in the process. We expect a lot of... » read more

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