category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Smart Manufacturing, Smart Data-AI, And Future Of Computing
By Melissa Grupen-Shemansky - 19 Sep, 2024 - Comments: 0

By Melissa Grupen-Shemansky, Pushkar Apte, and Mark da Silva Use of machine learning and artificial intelligence (ML/AI) is on an exponential rise across fields1 including all aspects of the semiconductor industry. In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, search engines and now large language models like Chat... » read more

3.5D: The Great Compromise
By Ed Sperling - 21 Aug, 2024 - Comments: 1

The semiconductor industry is converging on 3.5D as the next best option in advanced packaging, a hybrid approach that includes stacking logic chiplets and bonding them separately to a substrate shared by other components. This assembly model satisfies the need for big increases in performance while sidestepping some of the thorniest issues in heterogeneous integration. It establishes a midd... » read more

Increasing Roles For Robotics In Fabs
By Gregory Haley - 19 Aug, 2024 - Comments: 0

Different types of robots with greater precision and mobility are beginning to be deployed in semiconductor manufacturing, where they are proving both reliable and cost-efficient. Static robots have been used for years inside of fabs, but they now are being supplemented by collaborative robots (cobots), autonomous mobile robots (AMRs), and autonomous humanoid robots to meet growing and widen... » read more

Current Characterization Of Various Cu RDL Designs In Wafer Level Packages (WLP)
By JeongMin Ju - 15 Aug, 2024 - Comments: 0

Copper (Cu) redistribution layer (RDL) technology is used to interconnect chips in various high current Wafer Level Packaging (WLP) applications. Typically, Cu RDLs with thicknesses of 5-9 µm and widths of 5-20 µm are used for high current sourcing. In this case, the temperature of the Cu RDL metal line increases due to the Joule heat generated when current passes through the metal line. If a... » read more

Bringing Curvilinear Data To Mask Data Prep
By Al Blais - 15 Aug, 2024 - Comments: 0

Advanced nodes that have been leveraging curvilinear correction with technologies such as ILT and curvilinear OPC are increasingly requiring the use of curvilinear masks to meet advanced feature size and pitch requirements. However, building curvilinear masks with standard OASIS file formats can come at the cost of large file sizes, increased turnaround time, and reduced quality of results. The... » read more

Building Smarter, Better Fabs
By Laura Peters - 15 Aug, 2024 - Comments: 0

Battling labor shortages, faster ramp rates, and data overload, the process of designing and building greenfield fabs requires a combination of tech tools, failing earlier approaches and superior planning from day one. The complexity and scale of semiconductor fabs is skyrocketing as is the capital cost. Chipmakers are looking to ramp multibillion dollar fabs faster despite the hurdles of la... » read more

Improving Parasitic Capacitance In Next-Generation DRAM Devices
By Dempsey Deng - 15 Aug, 2024 - Comments: 0

As conventional DRAM devices continue to shrink, increases in parasitic capacitance at smaller dimensions can negatively impact device performance. New DRAM structures may be needed in the future, to lower total capacitance and achieve acceptable device performance. In this study, we compare the parasitic capacitance of a 6F2 honeycomb dynamic random-access memory (DRAM) device to the parasitic... » read more

Five Questions To Ask When Selecting A Temporary Bonding And Debonding System
By Jessica Albright - 15 Aug, 2024 - Comments: 0

High-bandwidth memory blocks (HBM), microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play the most crucial role in device reliability and efficient production will ensure you are maximizing your yield, whi... » read more

Why Small Fab And Assembly Houses Are Thriving
By Bryon Moyer - 15 Aug, 2024 - Comments: 0

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don't fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging lines serve for lower volumes, specialized technology, and prototyping. “There are companies that run literally one lot of 25 w... » read more

Securing Supply Chains At SEMICON West 2024
By John Cooney - 15 Aug, 2024 - Comments: 0

Jose Fernandez, U.S. Under Secretary of State for Economic Growth, Energy, and the Environment, sat down with Joe Stockunas, President of SEMI Americas, for a fireside chat on the CEO Summit keynote stage at SEMICON West 2024. In the Securing Critical Supply Chains for the 21st Century discussion, Fernandez emphasized the need to form partnerships to address vulnerabilities as the key to cre... » read more

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