category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Developing ReRAM As Next Generation On-Chip Memory For Machine Learning, Image Processing And Other Advanced CPU Applications
By Brett Lowe - 18 Jan, 2024 - Comments: 0

In modern CPU device operation, 80% to 90% of energy consumption and timing delays are caused by the movement of data between the CPU and off-chip memory. To alleviate this performance concern, designers are adding additional on-chip memory to their CPUs. Traditionally, SRAM has been the most widely used on-chip CPU memory type. Unfortunately, SRAM is currently limited to a size of hundreds of ... » read more

AI-Driven Innovation For Manufacturing Automation
By Calvin Shiao - 18 Jan, 2024 - Comments: 0

By Calvin Shiao, AshtonWS Huang, and Alfos Hsu Artificial intelligence (AI) is changing the world and improving our lives in many ways. The semiconductor industry is a key part of the AI revolution, as it provides powerful computing chips for AI applications and leverages AI to optimize business operations and management, customer service, office workflows, as well as the intricate realms of... » read more

Photonic Debonding Provides A Cost-Efficient, High-Throughput Debond Process
By Jessica Albright - 18 Jan, 2024 - Comments: 0

As emerging technologies require ultrathinned device wafers, traditional debonding processes can pose some challenges. Photonic debonding is an innovative debonding process utilizing a carrier coated with an inorganic metal release layer that aids in the release of the thinned wafer from the carrier substrate with no force and no damage to the delicate wafer upon activation of the release layer... » read more

Semiconductors Accelerate The Artificial Intelligence Revolution
By Ajit Manocha - 18 Jan, 2024 - Comments: 0

By Ajit Manocha, Pushkar Apte, and Melissa Grupen-Shemansky Five years ago, SEMI published an article predicting that Artificial Intelligence (AI) would change everything – and it has! AI has moved out of labs and taken popular imagination by storm. It is now a hot topic of discussion everywhere, from family dining tables and corporate boardrooms to corridors of government. While it m... » read more

An Efficient, Cost-Effective, Continuous Polymer Purification Method
By Brewer Science - 18 Jan, 2024 - Comments: 0

Polymer precipitation is a crucial process in chemical engineering and is widely applicable to many industries including semiconductors, pharmaceuticals, and wastewater treatment. In many industries, batch polymer precipitation is a common technique for polymer purification. However, batch polymer precipitation is an arduous and inefficient process, which generates excess solvent waste. It is l... » read more

3D Integration Supports CIM Versatility And Accuracy
By Katherine Derbyshire - 18 Jan, 2024 - Comments: 0

Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

Money Pours Into New Fabs And Facilities
By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Fabs Begin Ramping Up Machine Learning
By Anne Meixner - 19 Dec, 2023 - Comments: 0

Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions shrink and complexity increases with new materials and structures, processes, and packaging options, and as demand for reliability increases. Building robust models requires training the algorithms... » read more

Proprietary Vs. Commercial Chiplets
By Ed Sperling - 19 Dec, 2023 - Comments: 0

Large chipmakers are focusing on chiplets as the best path forward for integrating more functions into electronic devices. The challenge now is how to pull the rest of the chip industry along, creating a marketplace for third-party chiplets that can be chosen from a menu using specific criteria that can speed time to market, help to control costs, and behave as reliably as chiplets developed in... » read more

Industry Luminaries Highlight Opportunities For Advancing The Non-EUV Leading Edge
By Jan Willis - 19 Dec, 2023 - Comments: 0

The eBeam Initiative’s 12th annual Luminaries survey in 2023 reported a range of nodes from >5nm to 14nm as the most advanced non-EUV nodes using 193i lithography. A panel of semiconductor photomask and lithography experts debated several of the survey results, including this one, to provide more insights behind the results. Aki Fujimura, CEO of D2S, Inc., the managing company sponsor of t... » read more

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