category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Chiplet Fundamentals For Engineers: eBook
By Bryon Moyer - 02 Feb, 2026 - Comments: 1

Multi-die assemblies are the next phase of Moore's Law, scaling up and out  to improve performance and add flexibility into designs. By decomposing SoCs into building blocks, yield improves for the individual dies and overall performance increases because a chip is no longer bound by reticle limits. But this is much harder than it sounds. Chiplets don't just snap together like LEGOs, and so... » read more

Agentic AI In Chip Manufacturing
By Ed Sperling - 28 Jan, 2026 - Comments: 1

Agentic AI — breaking AI into individual agents that can work together and collaboratively — will be the real game changer for AI in chip manufacturing. By taking humans out of the loop, these agents can be programmed using natural language to automatically solve problems and improve efficiency. Jon Herlocker, vice president and general manager of software analytics at Cohu, talks  about w... » read more

Every Atom Now Counts In Advanced Chip Manufacturing
By Gregory Haley - 22 Jan, 2026 - Comments: 0

Artificial-intelligence workloads are pushing semiconductor design to a point where traditional scaling strategies are running out of room. Performance improvements that once came from shrinking transistors now depend increasingly on how devices are stacked, interconnected, and isolated. Transistor scaling still matters, but advanced device architectures no longer can accommodate the power dens... » read more

An Explosion In Interconnect Complexity
By Bryon Moyer - 22 Jan, 2026 - Comments: 0

For decades, electronics offered two levels of routing structure to manage signals that originate or terminate in an integrated circuit. Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also brings greater complexity and ratchets up the number of design decisions needed to complete a project. This transition has been evo... » read more

Oxides Bring Low Leakage Transistors To Leading-Edge Memories
By Katherine Derbyshire - 22 Jan, 2026 - Comments: 1

AI workloads need to position more memory that uses less power in ever-closer proximity to computational logic. That overriding imperative is driving new memory designs and new materials exploration across a wide range of applications, including cache memory, working memory, as well as a new category, non-volatile memory used for direct computation. The largest of these, by volume, is workin... » read more

Ripple Effects: Why Water Risk Is The Next Major Business Challenge For The Semiconductor Industry
By Alua Suleimenova - 22 Jan, 2026 - Comments: 0

The semiconductor industry is the bedrock of modern technology, enabling everything from AI and cloud computing to electric vehicles. Yet, this critical sector is also one of the most resource-intensive globally, with a substantial dependency on water. A single fabrication plant can demand up to 10 million gallons of water daily, comparable to the consumption of a city with 300,000 residents.... » read more

Annual Global IC Fabs And Facilities Report
By Liz Allan - 07 Jan, 2026 - Comments: 0

Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Investments came from both industry and government sources. Organizations worked together to solve current technology challenges, including soaring demand for AI chips and advanced memory, as well as complex applic... » read more

Cryogenic Etch: A Key Enabler Of 3D NAND
By Laura Peters - 05 Jan, 2026 - Comments: 0

Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications. Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance gains. With each new generation, NAND suppliers deliver 50% faster read/write speeds, 40% greater bit density, lower latency, ... » read more

Reliability And Traceability In Advanced Packages
By Ed Sperling - 24 Dec, 2025 - Comments: 0

The move from planar SoCs to advanced packages can improve performance and provide flexibility in large designs, which are difficult to fit onto a single reticle-sized die. But ensuring the device works as expected remains a challenge. There are multiple packaging options to choose from — 2.5D, fan-out wafer-level packaging, 3D-ICs, and various types of system-in-package — and many possible... » read more

Unlocking Next-Gen Thermal Management: Why Indium-Based Metal TIMs Are Game-Changers
By JinSeon Min - 18 Dec, 2025 - Comments: 0

As electronic devices become more powerful and compact, thermal management has become one of the most critical challenges in advanced electronic packaging. High-performance processors used in AI computing, data centers, and 5G/6G infrastructure generate significant heat, and failure to dissipate effectively can lead to reduced performance, reliability issues, and even catastrophic component fai... » read more

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