category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Faster Mask Synthesis With GPUs
By Travis Brist - 18 Dec, 2025 - Comments: 0

Design teams face rising pressure to deliver larger chips with higher transistor densities on tighter schedules using advanced node processing. The computing demands of modern applications, especially those making heavy use of AI, are extending pressure beyond design to every step of the development flow, including manufacturing, where photolithography and mask synthesis must keep pace. This po... » read more

Minimizing Voltage Loss And Improving Yield In Advanced GAA Chips
By Qingpeng Wang - 18 Dec, 2025 - Comments: 0

The problem: As metal pitch scaling shrinks to support the next generation of logic devices, the IR (or voltage) drop from conventional frontside connections has become a major challenge [1,2]. As electricity travels through a chip’s metal wiring, some voltage gets lost because wires have resistance. If the voltage drops too much, the chip’s transistors can’t get enough power and ... » read more

Reliability Risks Shift To The Materials Stack
By Gregory Haley - 18 Dec, 2025 - Comments: 0

The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

What’s Next for 2.5D Packaging?
By Bryon Moyer - 18 Dec, 2025 - Comments: 0

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they're built and assembled. Interposers are becoming thicker and more complex, while bridges are being used to reduce the assembled cost. Both efforts are facing new challenges. Interposers are effectively platforms on which mu... » read more

Macro Defect Inspection For Mission-Critical Defense, Aerospace, And Advanced R&D Fabs
By Errol Akomer - 18 Dec, 2025 - Comments: 0

Some fabs build consumer chips that sit inside phones and laptops. Others build chips that must survive in orbit, under the Arctic ice, or deep beneath the Earth’s surface. Fabs serving defense, aerospace, national laboratories, and other advanced R&D programs operate under some of the most stringent requirements in the industry. For these facilities, yield is not the only concern. Sec... » read more

Benefits And Limits Of Using ML For Materials Discovery
By Katherine Derbyshire - 18 Dec, 2025 - Comments: 0

Machine learning tools can accelerate all stages of materials discovery, from initial screening to process development. Whether the goal is to identify new applications for known materials or to design new molecules for a particular task, these tools help materials scientists find correlations in large data libraries. Still, machine learning tools are not magic. “Software tools are only as... » read more

Advanced Packaging: Driving Innovation, Performance, And New System Capabilities
By Cassandra Melvin - 18 Dec, 2025 - Comments: 0

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, even as the Moore’s Law roadmap for wafer-level scaling comes under strain. At the Advanced Packaging Conference during SEMICON Europa 2025 in Munich, global experts examined the growth tr... » read more

Generative AI In Chip Manufacturing
By Ed Sperling - 15 Dec, 2025 - Comments: 0

Generative AI is a natural-language or text-based query, predicting patterns based on a massive set of data. While most of the attention has been focused on chatbots and copilots, it also can be used to identify small, transient aberrations in semiconductor manufacturing that are otherwise difficult to find. Jon Herlocker, vice president and general manager of software analytics at Cohu, talks ... » read more

3DKs: Making Headway On Chiplet Standards
By Laura Peters - 01 Dec, 2025 - Comments: 0

The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon cycle is performed in-house. But the industry’s long-term goal of a free and open chiplet marketplace, in which companies of any size can reap the rewards and economies of scale associated with mult... » read more

AI-Driven Collaboration In Chip Manufacturing
By Ed Sperling - 24 Nov, 2025 - Comments: 0

3D chips and multi-die assemblies can offer significant improvements in performance and power, but the tradeoff is the increased amount of time and money it takes to generate working silicon. There are more process steps, more interactions between processes, and more data to manage throughout the manufacturing flow — so much, in fact, that it has now reached well beyond what even the best eng... » read more

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