Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration


The rapid evolution of Artificial Intelligence (AI) has surpassed the capabilities of traditional monolithic compute architectures. The industry is shifting toward a systemic approach, where large-scale distributed clusters of GPUs/AI accelerators function as a single, unified computational engine to support the next generation of trillion-parameter models. Co-packaged optics (CPO) offers s... » read more

Liquid Cooling Drives Other Localized Cooling


Key Takeaways: When converting from air to liquid cooling, components without liquid may become too hot. An entire board or system must undergo thermal analysis to ensure that any components that were once cool enough remain cool. Alternative cooling techniques may be needed for components without liquid cooling. Liquid cooling is proving effective at cooling high-power chip... » read more

2D Semiconductors Inch Forward


Key Takeaways: Diffusing oxygen into 2D materials can improve adhesion properties. Channel-last processes can preserve most of the traditional gate-all-around process flow. Dual-gate MoS2 FETs with graphene contacts take advantage of layer transfer methods. Transition metal dichalcogenides (TMDs) have come a long way since exfoliated flakes were the state of the art, but the... » read more

Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026


By Samer Bahou and Jaegwan Shim As the global semiconductor industry enters a decisive new phase shaped by artificial intelligence, SEMICON Korea 2026 convened the ecosystem from February 11–13 in Seoul, bringing together the companies, technologies, and talent required to sustain momentum on both sides of the AI equation: using AI to transform semiconductor operations, and advancing sem... » read more

Advanced Packaging Limits Come Into Focus


Key Takeaways: Packaging is now a performance variable. Substrate, bonding, and process sequence determine what can be built at scale. Warpage underlies most advanced packaging failures and gets harder to control as package sizes grow. Every proposed solution, such as glass, panel processing, and backside power, solves one problem while creating another. Moore's Law has shif... » read more

From Reactive to Predictive: AI-Driven Optimization for ATE Performance & Reliability


As ATE systems become increasingly complex and data-intensive, traditional rule-based optimization methods struggle to keep pace. In this Semicon Korea presentation, Cohu's Wai-Kong Chen will be exploring how artificial intelligence enables a paradigm shift from reactive troubleshooting to predictive and self-optimizing ATE systems. Read more here. Fig.1: Sweet spot inference.  Sourc... » read more

Tool And Methodology Changes Coming In Fab And Package Automation


Experts at the table: Semiconductor Engineering sat down to discuss what's changing in semiconductor fabs and packaging houses with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What foll... » read more

Making Hybrid Bonding Better


Key Takeaways Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps preserve the Cu/dielectric during aggressive processes. The future of semiconductor manufacturing is no longer dependent just on shrinking features. Instead, chipm... » read more

Back-End Automation Tackles Growing Complexity


Experts at the table: Semiconductor Engineering sat down to discuss back-end automation challenges in advanced packaging with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What follows are ex... » read more

Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers


Key Takeaways Backside power delivery reduces routing congestion at the most advanced nodes and offers significant performance improvement options. But it also adds a bunch of new challenges involving via alignment and interconnects. Still, leading-edge foundries are making progress, and all of them plan to offer BPDNs at 2nm and below. Backside power delivery networks deliv... » read more

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