What’s New At Hot Chips


By Jeff Dorsch & Ed Sperling Machine learning, artificial intelligence and neuromorphic computing took center stage at Hot Chips 2017 this week, a significant change from years past where the focus was on architectures that addressed improvements in speed and performance for standard compute problems. What is clear, given the focus of presentations, is that the bleeding edge of comput... » read more

The Week In Review: Manufacturing


Packaging and test IoT chip startup zGlue recently announced its technology, dubbed the zGlue Integrated Platform (ZiP). In ZiP, chip customers select and configure their designs based on chiplets. Chiplets are proven silicon IP from existing vendors. Then, the technology automatically generates potential implementations of a design. As part of the effort, zGlue has selected Advanced Semicondu... » read more

The Week In Review: IoT


Deals Advanced Semiconductor Engineering was selected by zGlue as its strategic manufacturing partner. The ASE Group will make the zGlue Integrated Platform, which is said to enable customization for consumer and industrial IoT markets. The ZiP integrates hardware and software in a modular 3DIC-based platform. ASE will assemble zGlue-certified chiplets for connecting through zGlue Smart Fabric... » read more

The Week In Review: Design


Tools Ansys updated its simulation suite, improving the speed of PCB and electronic package simulation as well as integrating its embedded systems tool with its failure analysis capabilities. Other updates include a new visual ray tracing capability to aid in antenna placement, improved modeling of the quality of wireless links in the presence of electromagnetic interference and RF interferenc... » read more

Blog Review: Aug. 23


Cadence's Madhavi Rao asks whether India should have more fabs and the role government policy should play. Synopsys' Kapil Rajpal checks out the Serial Peripheral Interface, which is emerging as a popular choice in automotive applications, and various vendor specific flavors. In a video, Mentor's Colin Walls explains inter-task communication and the basic mechanisms of how to pass data fr... » read more

The Week In Review: Manufacturing


Chipmakers Taiwan on Tuesday suffered a blackout after an accident occurred at a gas-fired plant, according to a report from Bloomberg. The outage, which lasted from 5 p.m. to 10 p.m., impacted more than 6 million homes and disrupted some IC production on the island, according to the report. Taiwan’s president was criticized for the event, as the government plans to shutter the island’s nu... » read more

The Week In Review: IoT


Connectivity Longing for LightSquared? The once-bankrupt company that tried to build a network with satellite airwaves and traditional spectrum has been reborn as Ligado Networks, which wants to serve 5G and Industrial Internet of Things applications with a mobile data network, employing satellite communications and other resources. Its founder is Philip Falcone, who was the guiding force behi... » read more

The Week In Review: Design


M&A Qualcomm expanded its AI portfolio, acquiring machine learning startup Scyfer B.V., a spinoff of the University of Amsterdam. Founded in 2013, Scyfer has consulted on object classification, defect inspection, and traffic prediction projects across a range of industries. Terms of the deal were not disclosed. Numbers Synopsys released third quarter financial results with revenue of $... » read more

Blog Review: Aug. 16


Cadence's Paul McLellan checks out how Imec sees the future of transistors and the challenges of 3D logic. Synopsys' Robert Vamosi gets a lesson on the electronic systems powering modern cars, and considers when it's ethical to hack one. Mentor's Colin Walls takes a look at how to pass data between RTOS tasks. Rambus' Aharon Etengoff looks at recent semi market predictions, from expand... » read more

The Week In Review: Manufacturing


Fab tools Lam Research held an analyst event this week. The company indicated that the industry is in the midst of a memory boom, including both DRAM and 3D NAND. According to Amit Daryanani, an analyst with RBC, here was one of the big takeaways at the event: “The memory spend portion of WFE is more sustainable than previously assumed due to end-market drivers such as big data, automation, ... » read more

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