Blog Review: Aug. 23

Fabs in India?; SPI in automotive; RTOS mailboxes; autonomous car safety; voice recognition; LER.


Cadence’s Madhavi Rao asks whether India should have more fabs and the role government policy should play.

Synopsys’ Kapil Rajpal checks out the Serial Peripheral Interface, which is emerging as a popular choice in automotive applications, and various vendor specific flavors.

In a video, Mentor’s Colin Walls explains inter-task communication and the basic mechanisms of how to pass data from one task to another in an RTOS.

Verification blogger Gaurav Jalan chats with DVCon India keynote speaker Apurva Kalia, who poses the question, “Would you send your child to school in an autonomous car?”

ARM’s Brian Fuller examines the improvements in speech recognition technology and the important role of AI and distributed computing.

Rambus’ Aharon Etengoff looks at method to ‘immunize’ IoT devices against malware outbreaks.

In a video, VLSIresearch’s G. Dan Hutcheson discusses the problem of measuring line edge roughness with Fractilia’s Chris Mack, and how computational metrology can help.

Ansys’ Paolo Colombo notes that the design mindset and collaboration that enabled the Wright brothers’ flying successes are still necessary for aeronautic innovation.

GlobalFoundries’ Dave Lammers points to the benefits of HBM2 memory for networking and the challenges as 2.5D chips spread to other markets.

Intel’s Julian Smith checks out what it takes to capture the sound of two black holes colliding.

Cadence’s Paul McLellan digs into a Linley Group analysis of the IoT market and the current state of enabling technologies.

Synopsys’ Abhishek Muchandikar considers how formal verification is like ancient Greek warfare.

Plus, check out the blogs highlighted in last week’s Manufacturing & Process Technology newsletter:

Editor In Chief Ed Sperling observes that adding data analysis to process technology development is just the beginning.

Executive Editor Mark LaPedus examines what’s driving up the price of materials.

Technical Editor Katherine Derbyshire finds that materials to replace copper at 5nm and beyond are starting to come into focus.

Coventor’s Sandy Wen digs into common waveguide issues and how to mitigate them.

Semico Research’s Jim Feldhan and Adrienne Downey take a closer look at the current state of memory manufacturing.

eBeam Initiative’s Jan Willis interviews SPIE BACUS’ president about EUV mask inspection and the impact of machine learning.

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