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Blog Review: Sept. 13


Mentor's Andrew Macleod points to some important things to consider when beginning an automotive IC project and why differentiation, not commoditization, should be the goal. Synopsys' Amit Paunikar examines the architecture changes that make LPDDR4 faster while consuming less power. Cadence's Paul McLellan shares highlights from CDNLive Boston, from the latest in silicon photonics to how ... » read more

The Week In Review: Design


Tools Cadence unveiled an integrated memory design and verification tool, with environments for bitcell design, array and complier verification, and memory characterization. It utilizes existing simulation databases for multi-corner and Monte Carlo analysis, which the company says can lead to a 2X runtime improvement. Solido Design Automation uncorked PVTMC Verifier, which uses machine lear... » read more

Blog Review: Aug. 30


Cadence's Meera Collier explains machine learning, unsupervised algorithms, and why Facebook's recently publicized AI chatbot conversation isn't as inscrutable as it sounds. Synopsys' Robert Vamosi considers recently proposed legislation which seeks to mitigate the risk of botnets commandeering IoT devices used in the U.S. government, including limiting the use of hard-coded passwords and ce... » read more

The Week In Review: Design


Tools Ansys updated its simulation suite, improving the speed of PCB and electronic package simulation as well as integrating its embedded systems tool with its failure analysis capabilities. Other updates include a new visual ray tracing capability to aid in antenna placement, improved modeling of the quality of wireless links in the presence of electromagnetic interference and RF interferenc... » read more

Blog Review: Aug. 23


Cadence's Madhavi Rao asks whether India should have more fabs and the role government policy should play. Synopsys' Kapil Rajpal checks out the Serial Peripheral Interface, which is emerging as a popular choice in automotive applications, and various vendor specific flavors. In a video, Mentor's Colin Walls explains inter-task communication and the basic mechanisms of how to pass data fr... » read more

Blog Review: Sept. 14


Are wide bandgap lll-V power devices feasible? Applied's Ben Lee considers the challenges, and potential rewards, of silicon carbide and gallium nitride. DVCon India chair Gaurav Jalan chats with keynote speaker Alok Jain about the challenges of verifying complex SoCs, the unique verification needs of the IoT, and what might lie beyond UVM. From power intent abstraction to automatic power... » read more

Blog Review: Sept. 7


In a video, Cadence's Kishore Kasamsetty contends that one-size-fits-all DDR PHY no longer works and looks into the unique requirements of different application segments. Synopsys' Eric Huang gives a brief overview of the five components required for USB certification. Mentor's Andrew Macleod presents a way Apple Cars could rake in revenue beyond the vehicle itself. When it comes to hi... » read more

The Week In Review: Design


Tools Aldec uncorked its TySOM embedded development kit, which includes Riviera-PRO mixed-HDL language simulation for VHDL 2008/Verilog 2005, a Xilinx Zynq-based development board and pre-validated Ubuntu Embedded Host reference designs and tutorials. Mentor Graphics introduced the first phase of its new Xpedition PCB design flow with technologies for design and verification of rigid and ... » read more

The Week In Review: Design/IoT


M&A Tessera boosted its 2.5D and 3D-IC capabilities with the acquisition of Ziptronix. The $39 million cash purchase adds a low-temperature wafer bonding technology platform, which has been licensed to Sony for volume production of CMOS image sensors. Numbers Semico Research forecasts that the SoC market will approach $200 billion by 2019. According to its analysis, average die are... » read more