The Week In Review: Design/IoT

Tessera acquires Ziptronix; SoC market: $200 billion by 2019?; Synopsys stock repurchase; DVCon India approaches.



Tessera boosted its 2.5D and 3D-IC capabilities with the acquisition of Ziptronix. The $39 million cash purchase adds a low-temperature wafer bonding technology platform, which has been licensed to Sony for volume production of CMOS image sensors.


Semico Research forecasts that the SoC market will approach $200 billion by 2019. According to its analysis, average die area partitioning for all SoC types is forecast to reach 75% for memory, 9% for reused logic and 16% for new logic by 2019.

Synopsys put forth an accelerated share repurchase agreement for $100 million of their stock.


DVCon India returns for its second year on Sept. 10-11 in Bangalore. The conference’s tracks focus on ESL (spotlighting virtual prototypes, pre-silicon software development and debug, power and performance analysis, architectural exploration, and high-level synthesis) and Design and Verification (including simulation methodologies, static design analysis, formal verification, hardware acceleration, in-circuit emulation, and silicon prototyping).

Can’t make it out to India? DVCon U.S. (Feb. 29 – Mar. 3 2016; San Jose, CA) is now accepting tutorial and panel proposals. The deadline for submission is Oct. 2.

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