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The Quest For Curvilinear Photomasks


The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

EUV Pellicles Finally Ready


After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) lithography is changing. ASML, the sole supplier of EUV pellicles, is transferring the assembly and distribution of these products to Mitsui. Others are also developing pellicles for EUV, a next-gen... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

EUV Challenges And Unknowns At 3nm and Below


The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

EUV’s Uncertain Future At 3nm And Below


Several foundries have moved extreme ultraviolet (EUV) lithography into production at both 7nm and 5nm, but now the industry is preparing for the next phase of the technology at 3nm and beyond. In R&D, the industry is developing new EUV scanners, masks and resists for the next nodes. 3nm is slated for 2022, followed by 2nm a year or two later. Nonetheless, it will require massive funding... » read more

Improving EUV Process Efficiency


The semiconductor industry is rethinking the manufacturing flow for extreme ultraviolet (EUV) lithography in an effort to improve the overall process and reduce waste in the fab. Vendors currently are developing new and potentially breakthrough fab materials and equipment. Those technologies are still in R&D and have yet to be proven. But if they work as planned, they could boost the flo... » read more

Lithography Options For Next-Gen Devices


Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

Week In Review: Manufacturing, Test


Chipmakers TrendForce released its foundry rankings for the first quarter of 2019. TSMC is still the clear leader, followed in order by Samsung, GlobalFoundries and UMC, according to the firm. It was a tough quarter for all foundries. Samsung has rolled out its new High Bandwidth Memory (HBM2E) product. The new solution, called Flashbolt, is the industry’s first HBM2E to deliver a 3.2Gbps... » read more

Searching For EUV Defects


Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this oft-delayed technology can be used in production. One lingering issue that is becoming more worrisome is how to find defects caused by [gettech id="31045" comment="EUV"] processes. These processes can cause random variations, also known as stochastic effects... » read more

EUV’s New Problem Areas


Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

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