category: News

category: IoT, Security & Automotive

Blog Review: Aug. 24
By Jesse Allen - 24 Aug, 2016 - Comments: 0

Cadence's Christine Young relates a talk by IEEE president-elect Karen Bartleson, who stresses the need for technologists and policy makers to work together to shape the future of the Internet. In his latest video, Mentor's Colin Walls muses about creeping elegance in embedded software development. Synopsys' Michael Posner considers whether USB Type-C should replace the 3.5mm headphone ja... » read more

The Week in Review: IoT
By Jeff Dorsch - 19 Aug, 2016 - Comments: 1

Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 19 Aug, 2016 - Comments: 0

Fab tool and material vendors Applied Materials reported its results for the third quarter ended July 31. Net sales of $2.82 billion were up 15% sequentially and up 13% year over year. "AMAT reported impressive upside in July quarter and guided October quarter well ahead of expectations as the company is seeing sizable tailwinds across: 1) WFE uptick driven by foundry and NAND orders; 2) stron... » read more

The Week In Review: Design
By Jesse Allen - 19 Aug, 2016 - Comments: 0

Tools Aldec uncorked its TySOM embedded development kit, which includes Riviera-PRO mixed-HDL language simulation for VHDL 2008/Verilog 2005, a Xilinx Zynq-based development board and pre-validated Ubuntu Embedded Host reference designs and tutorials. Mentor Graphics introduced the first phase of its new Xpedition PCB design flow with technologies for design and verification of rigid and ... » read more

Blog Review: Aug. 17
By Jesse Allen - 17 Aug, 2016 - Comments: 0

Mentor's Andrew Macleod listens in on the most pressing electrical engineering and embedded software challenges in the automotive industry today, in an IESF presentation by Paul Johnston. Many flash memory protocols have appeared, and Synopsys' Rahul Ramesh Chaudhari delves into ONFi in particular. Cadence's Paul McLellan digs into the challenges facing the development and roll out of 5G.... » read more

10nm Race Heats Up
By Mark LaPedus - 16 Aug, 2016 - Comments: 0

The 10nm process and foundry race is heating up, as Intel announced its 10nm technology at its annual conference. As part of the multi-pronged announcement, Intel’s foundry unit forged a major partnership with ARM. Specifically, ARM will make its physical intellectual-property (IP) available on Intel’s 10nm process. Intel, in turn, will offer the IP for foundry customers. And on to... » read more

The Week In Review: IoT
By Jeff Dorsch - 12 Aug, 2016 - Comments: 0

Deals Rambus completed its $32 million acquisition of the Snowbush IP assets from Semtech. Through the end of 2022, Rambus may make additional payments on the transaction, depending upon new product sales. The Snowbush IP assets became part of the Memory and Interfaces Division at Rambus, complementing the company’s offerings in IP and serializer/deserializer blocks. Samsung Electronics A... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

The Week In Review: Design
By Jesse Allen - 12 Aug, 2016 - Comments: 0

IP Avery Design Systems released NVM Express over Fabrics 1.0 and NVM Express 1.2.1 extensions to its NVM-Xactor verification IP, enabling verification of both NVMe over PCIe and NVMe over Fabrics designs. Arastu Systems uncorked an optimized DDR3/4 DRAM Controller Core, which works with DFI 3.1 compatible PHY. The core supports all key DDR3/DDR4 features and additional features like Erro... » read more

Blog Review: Aug. 10
By Jesse Allen - 10 Aug, 2016 - Comments: 0

Is the end near for FinFETs? Applied's Mike Chudzik digs into the impact of rising parasitic resistance and parasitic capacitance and the challenges of scaling to 5nm. Cadence's Paul McLellan checks out the method UC Berkeley is using to build RISC-V processors. Mentor's Colin Walls warns that in C even the simplest things, like the declaration of variables, have pitfalls for the unwary. ... » read more

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