Power/Performance Bits: Aug. 24


Low power AI Engineers at the Swiss Center for Electronics and Microtechnology (CSEM) designed an SoC for edge AI applications that can run on solar power or a small battery. The SoC consists of an ASIC chip with RISC-V processor developed at CSEM along with two tightly coupled machine-learning accelerators: one for face detection, for example, and one for classification. The first is a bin... » read more

Manufacturing Bits: Aug. 17


Scaling qubits Australia is a hotbed of R&D activity, especially in the field of quantum computing. For example, the University of New South Wales (UNSW) in Australia has demonstrated a possible way to control millions of qubits in a silicon quantum chip. Researchers from UNSW Sydney have devised a new three-dimensional dielectric resonator, a technology that could deliver controlled... » read more

Power/Performance Bits: Aug. 17


Digital fiber Researchers at MIT, Harrisburg University of Science and Technology, and Rhode Island School of Design developed a digital fiber that can sense, store, analyze, and infer activity after being sewn into a shirt. "This work presents the first realization of a fabric with the ability to store and process data digitally, adding a new information content dimension to textiles and a... » read more

Manufacturing Bits: Aug. 9


Quantum RF sensors The quantum computer market is an emerging and hot business. So is the quantum sensor market, where several entities are developing this technology for a range of applications. “Quantum sensors utilize quantum states for measurements,” according to Chalmers University of Technology. “They capitalize on the fact that quantum states are extremely sensitive to disturba... » read more

Power/Performance Bits: Aug. 9


Capacitors in interposers Scientists at Tokyo Institute of Technology developed a 3D functional interposer containing an embedded capacitor. They tout the design as saving package area and reducing wiring length, resulting in less noise and power consumption. The capacitive elements are embedded inside a 300mm silicon piece using permanent adhesive and mold resin. The interconnects between ... » read more

Manufacturing Bits: Aug. 3


World’s thinnest magnet Lawrence Berkeley National Laboratory, the University of California at Berkeley and others have developed what researchers say is the world’s thinnest magnet. The one-atom-thin, two-dimensional (2D) magnet could one day pave the way towards new spin electronics or spintronics memory devices and other technologies in the market. Spintronics uses the orientation of... » read more

Power/Performance Bits: Aug. 3


Efficient ADC Researchers at Brigham Young University, National Yang Ming Chiao Tung University, Texas Instruments, and University of California Los Angeles designed a new power-efficient high-speed analog-to-digital converter. The ADC consumes only 21 milli-Watts of power at 10GHz for ultra-wideband wireless communications, much lower than other ADCs that consume hundreds of milli-Watts to... » read more

Manufacturing Bits: July 27


Merchant quantum processors Startup QuantWare has launched the world’s first merchant and off-the-shelf superconducting processor for quantum computers. QuantWare’s quantum processor unit (QPU), called Soprano, is a 5-qubit device. The QPU can be customized for various applications. The device is ideal for research institutions and university labs. Quantum computing is a hot topic. A... » read more

Power/Performance Bits: July 27


Amplifying light for lidar Engineers at University of Texas at Austin and University of Virginia developed a light detector that can amplify weak light signals and reduce noise to improve the accuracy of lidar. "Autonomous vehicles send out laser signals that bounce off objects to tell you how far away you are. Not much light comes back, so if your detector is putting out more noise than th... » read more

Manufacturing Bits: July 20


Interference EUV lithography ESOL has developed a standalone interference extreme ultraviolet (EUV) lithography tool for use in R&D applications. The system, called EMiLE (EUV Micro-interference Lithography Equipment), is primary used to speed up the development of EUV photoresists and related wafer processes. The system is different than ASML’s EUV lithography scanners, which are ... » read more

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