category: Research

category: IoT, Security & Automotive

Manufacturing Bits: Jan. 5
By Mark LaPedus - 05 Jan, 2021 - Comments: 0

Gallium oxide chips The National Renewable Energy Laboratory (NREL), the Colorado School of Mines, and Saint-Gobain Crystals have teamed up to develop manufacturing technologies and devices based on an emerging material called gallium oxide. This work is part of a three-year program, dubbed the Oxide Electronic Devices for Extreme Operating Environments project, which is funded by the U.S. ... » read more

Power/Performance Bits: Jan. 5
By Jesse Allen - 05 Jan, 2021 - Comments: 0

Quiet qubits Researchers at the University of New South Wales Sydney recorded the lowest noise levels yet for a semiconductor qubit. Charge noise caused by material imperfections interferes with the information encoded on qubits, reducing accuracy. "The level of charge noise in semiconductor qubits has been a critical obstacle to achieving the accuracy levels we need for large-scale error-c... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2020 - Comments: 1

Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

Power/Performance Bits: Dec. 29
By Jesse Allen - 29 Dec, 2020 - Comments: 0

Safer Li-ion batteries Scientists from Stanford University and the Department of Energy's SLAC National Accelerator Laboratory propose a way to make lithium-ion batteries lighter, more efficient, and fire resistant. One of the heaviest components of lithium-ion batteries are the copper or aluminum sheets that act as current collectors. "The current collector has always been considered de... » read more

Manufacturing Bits: Dec. 23
By Mark LaPedus - 23 Dec, 2020 - Comments: 0

Magnetic glue Nanyang Technological University (NTU) Singapore has developed a new magnetic-activated glue technology. Conventional glue or adhesives involve epoxy and related materials. These adhesives are used to bond plastics, ceramics and wood. The adhesives are bonded and cured using moisture, heat or light. The curing temperatures range from room temperature to 80 degrees Celsius. ... » read more

Power/Performance Bits: Dec. 23
By Jesse Allen - 23 Dec, 2020 - Comments: 0

Detecting early damage in power electronics Researchers at Osaka University to detect early damage in power electronics. The team used acoustic emission analysis to monitor in real time the propagation of cracks in a silicon carbide Schottsky diode during power cycling tests. During the power cycling test, the researchers mimicked repeatedly turning the device on and off, to monitor the res... » read more

Manufacturing Bits: Dec. 15
By Mark LaPedus - 15 Dec, 2020 - Comments: 0

Ghost imaging quantum microscopes The U.S. Department of Energy’s (DOE) Brookhaven National Laboratory has begun building a quantum-enhanced X-ray microscope based on a technology called ghost imaging. Still in R&D, quantum X-ray microscopes promise to provide higher resolution images with less damage to a sample. Using the National Synchrotron Light Source II (NSLS-II), researcher... » read more

Power/Performance Bits: Dec. 15
By Jesse Allen - 15 Dec, 2020 - Comments: 0

Graphite films for cooling electronics Researchers at King Abdullah University of Science and Technology (KAUST) developed a way to make a carbon material well suited to dissipating heat in electronic devices. Graphite films are frequently used for heat management. "However, the method used to make these graphite films, using polymer as a source material, is complex and very energy intensiv... » read more

Manufacturing Bits: Dec. 7
By Mark LaPedus - 07 Dec, 2020 - Comments: 0

Cybersecurity for manufacturing The University of Texas at San Antonio (UTSA) has launched a center to address cybersecurity issues in the U.S. manufacturing sector. The center, called the Cybersecurity Manufacturing Innovation Institute (CyManII), is a $111 million public-private partnership. As part of the effort, UTSA will enter into a five-year corporative agreement with the U.S. Depart... » read more

Power/Performance Bits: Dec. 7
By Jesse Allen - 07 Dec, 2020 - Comments: 0

Logic-in-memory with MoS2 Engineers at École Polytechnique Fédérale de Lausanne (EPFL) built a logic-in-memory device using molybdenum disulfide (MoS2) as the channel material. MoS2 is a three-atom-thick 2D material and excellent semiconductor. The new chip is based on floating-gate field-effect transistors (FGFETs) that can hold electric charges for long periods. MoS2 is particularly se... » read more

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