category: Research

category: IoT, Security & Automotive

Manufacturing Bits: Oct. 29
By Mark LaPedus - 29 Oct, 2019 - Comments: 1

Searching for dark energy The first tests have been conducted on a new cosmic cartography system that will soon search for dark energy and galaxies in the universe. The system, called the Dark Energy Spectroscopic Instrument (DESI), is a complex unit with 5,000 fiber-optic eyes. The DESI system is mounted on top of the 4-meter Mayall Telescope at the Kitt Peak National Observatory in Ariz... » read more

Power/Performance Bits: Oct. 29
By Jesse Allen - 29 Oct, 2019 - Comments: 0

Chip scanning Researchers at the University of Southern California and the Paul Scherer Institut in Switzerland developed an x-ray technique to non-destructively scan chips to make sure they conform to specifications. Such a system could be used to identify manufacturing defects or malicious alterations, the team said. Called ptychographic x-ray laminography, the technique utilizes x-rays f... » read more

Manufacturing Bits: Oct. 22
By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Power/Performance Bits: Oct. 22
By Jesse Allen - 22 Oct, 2019 - Comments: 0

Flexible battery Researchers at ETH Zurich developed a flexible thin-film battery that can be bent, stretched, and twisted without interrupting the supply of power. Key to the battery is a new electrolyte and entirely flexible components. "To date, no one has employed exclusively flexible components as systematically as we have in creating a lithium-ion battery," said Markus Niederberger, P... » read more

Manufacturing Bits: Oct. 15
By Mark LaPedus - 15 Oct, 2019 - Comments: 0

Sandia’s fab upgrade Sandia National Laboratories has completed the first phase of a three-year upgrade program in its semiconductor wafer fab. The goal of the program is to convert Sandia’s Albuquerque, N.M.-based fab from 150mm (6-inch) to 200mm (8-inch) wafer sizes. As part of the move, Sandia is converting its 0.35-micron (350nm) rad-hard process from 150mm to 200mm. The process is ... » read more

Power/Performance Bits: Oct. 15
By Jesse Allen - 15 Oct, 2019 - Comments: 0

Probabilistic computing Researchers at Purdue University and Tohoku University built a hardware demonstration of a probabilistic computer utilizing p-bits to perform quantum computer-like calculations. The team says probabilistic computing could bridge the gap between classical and quantum computing and more efficiently solve problems in areas such as drug research, encryption and cybersecurit... » read more

System Bits: Oct. 15
By Jeff Dorsch - 15 Oct, 2019 - Comments: 0

When self-driving cars collide As self-driving car technology develops and evolves, it is inevitable that there will be collisions while the tech matures. “What can we do in order to minimize the consequences?” asks Amir Khajepour, a professor of mechanical and mechatronics engineering at the University of Waterloo. “That is our focus.” The first rule for the autonomous vehicle (... » read more

Manufacturing Bits: Oct. 9
By Mark LaPedus - 09 Oct, 2019 - Comments: 0

World’s strongest silver A group has developed what researchers say is the world’s strongest silver. The silver demonstrated a hardness of 3.05 GPa, which is 42% stronger than the previous world record. The University of Vermont, Lawrence Livermore National Lab, the Ames Laboratory, Los Alamos National Laboratory and UCLA contributed to the work. Silver is an element with high electr... » read more

Power/Performance Bits: Oct. 9
By Jesse Allen - 09 Oct, 2019 - Comments: 0

Topological insulator waveguides Engineers at the University of Pennsylvania and Polytechnic University of Milan applied topological insulators to photonic chips to make reconfigurable waveguides. In topological insulators, charged particles can flow freely on the material's edges but can't pass through the interior. For photonics, topological insulators with edges that could be redefined m... » read more

System Bits: Oct. 9
By Jeff Dorsch - 09 Oct, 2019 - Comments: 0

Bringing plasmonic color to solid materials Researchers at the University of California, Riverside, used silver nanoparticles (AgNPs) to produce plasmonic color-switchable films for solid materials. This effect was previously achieved only in liquids. Rapid and reversible tuning of plasmonic color in solid films, a challenge until now, holds great promise for a number of applications,” sa... » read more

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