Manufacturing Bits: Feb. 26


Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

System Bits: Feb. 26


Firefly microstructures in LED light bulbs Pennsylvania State University researchers wanted to improve the energy efficiency of commercial light-emitting diode light bulbs to save even more energy. They found the answer in the lantern surface of fireflies. "LED lightbulbs play a key role in clean energy," said Stuart (Shizhuo) Yin, professor of electrical engineering at Penn State. "Overall... » read more

Power/Performance Bits: Feb. 26


Integrated RRAM for edge AI Researchers at CEA-Leti and Stanford University have developed the first circuit integrating multiple-bit non-volatile Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. The proof-of-concept chip monolithically integrates two heterogeneous technologies: 18KB of on-chip... » read more

Manufacturing Bits: Feb. 19


Computed Axial Lithography Lawrence Livermore National Laboratory (LLNL) and the University of California at Berkeley have developed a 3D printing method to produce a new class of polymer parts. The technology, called Computed Axial Lithography (CAL), projects photons on a resin in a vial within a 3D printer. In total, researchers have demonstrated the ability to shine 1,440 different proje... » read more

System Bits: Feb. 19


Eco-friendly material for wireless IoT sensors Researchers at Canada’s Simon Fraser University and in Switzerland collaborated on developing a wood-derived cellulose material that could be used in a 3D printer, instead of the customary plastic and polymeric materials for electronics. With 3D printing, the material can offer flexibility to add or embed functions onto 3D shapes or fabrics, the... » read more

Power/Performance Bits: Feb. 19


Flexible energy harvesting rectenna Researchers from MIT, Universidad Politécnica de Madrid, University Carlos III of Madrid, Boston University, University of Southern California, and the Army Research Laboratory created a flexible rectenna capable of converting energy from Wi-Fi signals into electricity to power small devices and sensors. The device uses a flexible RF antenna to capture e... » read more

Manufacturing Bits: Feb. 11


How things stick together Using a metrology technique called atomic force microscopy (AFM), Brown University has gained more insights into the theory of adhesion or how things stick together. Understanding the theory of adhesion also has some practical applications. It could pave the way towards a new class of MEMS or nanoscale devices. Nanoscale patterning is another potential application.... » read more

Power/Performance Bits: Feb. 11


Body heat harvesting Chemists at the University of Massachusetts Amherst developed a fabric that can harvest body heat to power small wearable electronics such as activity trackers. The device works on the thermoelectric effect created by body temperature and ambient cooler air. "What we have developed is a way to inexpensively vapor-print biocompatible, flexible and lightweight polymer fil... » read more

System Bits: Feb. 11


Modeling computer vision on human vision University of Michigan scientists used digital foveation technology to render images that are more comprehensible to machine vision systems, while also reducing energy consumption by 80%. The effect is achieved by manipulating a camera’s firmware. “It'll make new things and things that were infeasible before, practical,” Professor Robert Dick s... » read more

Manufacturing Bits: Feb. 5


Multi-beam litho shakeout The multi-beam e-beam market for lithography applications continues to undergo a shakeout amid technical roadblocks and other issues. Last week, ASML announced that it had acquired the intellectual-property (IP) assets of Mapper Lithography, a Dutch supplier of multi-beam e-beam tools for lithography applications that fell into bankruptcy late last year. As it t... » read more

← Older posts Newer posts →