category: Research: MDT

category: IoT, Security & Automotive

Manufacturing Bits: Jan. 30
By Mark LaPedus - 30 Jan, 2018 - Comments: 0

SRC’s new R&D centers The Semiconductor Research Corp. has launched a network of research centers within its recently-announced Joint University Microelectronics Program (JUMP). SRC officially launched the 5-year, $200 million program on Jan. 1. With various research centers, the mission of JUMP is to lay the groundwork that extends the viability of Moore’s Law through 2040. The idea is... » read more

Manufacturing Bits: Jan. 23
By Mark LaPedus - 23 Jan, 2018 - Comments: 1

Looking inside memristors E-beam inspection is gaining steam. Using this type of technology, the National Institute of Standards and Technology (NIST) has been able to see the inner workings of the memristor. The memristor is a type of ReRAM, which works by changing the resistance of materials. In a memristor, an electric current is applied to a material, changing the resistance of that mat... » read more

Manufacturing Bits: Jan. 16
By Mark LaPedus - 16 Jan, 2018 - Comments: 0

Coherent X-ray imaging Russia’s National University of Science and Technology MISIS has developed a non-destructive way to observe the inner structures of photonic crystals. The technology, called ptychographic coherent X-ray imaging, obtains the electron density of colloidal crystals. Ptychography is a lensless, X-ray coherent imaging technique. Others are also working on the techno... » read more

Manufacturing Bits: Jan. 9
By Mark LaPedus - 09 Jan, 2018 - Comments: 0

Two-photon lithography Lawrence Livermore National Laboratory (LLNL) has extended the capabilities of a high-resolution 3D printing technique called two-photon lithography (TPL). TPL enables the development of 3D-printed objects. LLNL’s technology could enable 3D-printed embedded structures inside the body, such as stents, joint replacements or bone scaffolds. It could also one day be ... » read more

Manufacturing Bits: Jan. 2
By Mark LaPedus - 02 Jan, 2018 - Comments: 0

World’s coldest chip Using a network of nuclear refrigerators, the University of Basel and others claim to have set the record for the world’s coldest chip. Researchers have cooled a chip to a temperature lower than 3 millikelvin. A millikelvin is one thousandth of a kelvin. Absolute zero is 0 kelvin or minus 273.15 °C. In the experiment, researchers used a chip that includes a Coulomb... » read more

Manufacturing Bits: Dec. 19
By Mark LaPedus - 19 Dec, 2017 - Comments: 0

Superconducting magnet record The National High Magnetic Field Laboratory (MagLab) has broken another world record for magnets. With a superconducting magnet, MagLab reached a magnetic field of 32 teslas. This is a third stronger than the previous record and more than 3,000 times stronger than a refrigerator magnet, according to MagLab. Tesla, or T, is the measurement of magnetic field ... » read more

Manufacturing Bits: Dec. 12
By Mark LaPedus - 12 Dec, 2017 - Comments: 0

3D diodes At the recent IEEE International Electron Devices Meeting (IEDM) in San Francisco, the Ecole Polytechnique Fédérale de Lausanne (EPFL) and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) presented a paper on what they call the world’s first back-illuminated 3D-stacked, single-photon avalanche diode (SPAD) in 45nm CMOS technology. A SPAD is one type of a photodetector. These... » read more

Manufacturing Bits: Dec. 5
By Mark LaPedus - 05 Dec, 2017 - Comments: 3

Intel vs. GlobalFoundries At the IEEE International Electron Devices Meeting (IEDM) this week, GlobalFoundries and Intel will square off and present papers on their new logic processes. Intel will present more details about its previously-announced 10nm finFET technology, while GlobalFoundries will discuss its 7nm finFET process. As expected, Intel and GlobalFoundries will use 193nm immersi... » read more

Manufacturing Bits: Nov. 28
By Mark LaPedus - 28 Nov, 2017 - Comments: 0

Cryogenic microscopes The European Synchrotron Radiation Facility (ESRF) has developed and commissioned a new cryo-electron microscope. A form of transmission electron microscopy (TEM), cryo-electron microscopy (cryo-EM) is used to study a sample at cryogenic temperatures. A gas is assumed to be cryogenic if it can be liquefied at or below −150 °C. Cyro-EM is often used in structural ... » read more

Manufacturing Bits: Nov. 21
By Mark LaPedus - 21 Nov, 2017 - Comments: 0

Germanium-on-mica Germanium is an element that can be used in various applications in electronics, such as optoelectronics, semiconductors and others. For example, silicon-germanium (SiGe), an alloy of silicon and germanium, is used for making RF chips. In future finFET transistors, some are exploring the idea of using pure germanium for the PFET structure to boost the electron mobility in ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy