Manufacturing Bits: Oct. 12


MoSi2 pellicles for EUV Hanyang University has presented a paper that describes a novel molybdenum disilicide (MoSi2) pellicle membrane for use in extreme ultraviolet (EUV) lithography. With a 28nm thickness, a MoSi2 membrane has demonstrated a 89.33% transmittance for EUV lithography. The pellicle technology is still in R&D. MoSi2, which is a silicide of molybdenum, is a refractory cer... » read more

Manufacturing Bits: Oct. 6


High-NA EUV mask materials A team of researchers have presented a new paper on the tradeoffs of photomask absorber materials for high-NA extreme ultraviolet (EUV) lithography. In the paper, researchers concluded that the industry will likely require an alternative mask absorber stack for high-numerical aperture (high-NA) EUV lithography. Fraunhofer, Imec, ASML and Zeiss contributed to the... » read more

Manufacturing Bits: Sept. 29


Exploring chemical reactions using EUV The University of Tokyo has established a facility to study fast chemical reactions using a coherent extreme ultraviolet light source. The new coherent extreme ultraviolet (XUV) source facility enables researchers to explore time-dependent phenomena, such as ultrafast chemical reactions of biological or physical samples. Located in an underground fa... » read more

Manufacturing Bits: Sept. 22


Hairy nanoparticles The U.S. Air Force Research Laboratory is developing a new type of material called preceramic polymer-grafted nanoparticles or “hairy nanoparticles” (HNP). HNPs can be used to manufacture a new class of aircraft parts made of ceramic composite materials. An HNP is a hybrid material. It is based on a polymer shell, which is bound to a nanoparticle core, according to t... » read more

Manufacturing Bits: Sept. 15


World’s largest camera The Department of Energy’s SLAC National Accelerator Laboratory has taken a step towards the development of the world’s largest digital camera. Target for astronomy applications, SLAC has developed a large 3,200-megapixel sensor array and has taken its first photos with the system. The sensor array will be integrated into the world’s largest digital camera, wh... » read more

Manufacturing Bits: Sept. 9


Fusion energy The U.S. Department of Energy (DOE) has announced $29 million in funding for several projects to develop fusion energy technology. The projects will focus on the components, materials and technologies to develop a long-awaited but elusive net-energy-gain “fusion core.” For years, companies, governments and universities have been working on fusion power technology. Fu... » read more

Manufacturing Bits: Sept. 1


AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Manufacturing Bits: Aug. 25


DNA storage for TV shows DNA storage was a hot topic about two or so years ago, but it’s been somewhat quiet since that time. DNA storage is back in the news. For the first time, Twist Bioscience has stored an episode of a new Netflix show using its synthetic DNA technology. The new show, BIOHACKERS, is a new six-part biotech thriller. Deoxyribonucleic acid (DNA) is a molecule that car... » read more

Manufacturing Bits: Aug. 18


Quantum Internet The U.S. Department of Energy (DOE) recently unveiled a strategy to develop a quantum Internet in the United States. DOE’s 17 National Laboratories will serve as the backbone of the quantum Internet, which will rely on the laws of quantum mechanics to control and transmit information over a network. Currently in its initial stages of development, the quantum Internet coul... » read more

Manufacturing Bits: Aug. 10


EUV mask cleaning process TSMC has developed a new dry-clean technology for photomasks used in extreme ultraviolet (EUV) lithography, a move that appears to solve some major problems in the fab. TSMC and Samsung are in production with EUV lithography at advanced nodes, but there are still several challenges with the photomasks and other parts of the technology. Using 13.5nm wavelengths, EUV... » read more

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