category: Round Tables

category: IoT, Security & Automotive

Is The Stacked Die Ecosystem Stagnating?
By Ann Mutschler - 18 Dec, 2014 - Comments: 2

It is now widely agreed that not much has been happening in terms of adoption for 2.5D interposer and 3D ICs. “It seems like everyone is still at the starting line waiting for the race to begin," said Javier DeLaCruz, senior director of engineering of [getentity id="22242" e_name="eSilicon"]. "Interposer assembly and IP availability for effectively using the [getkc id="82" comment="2.5D IC... » read more

Software-Driven Verification (Part 1)
By Brian Bailey - 18 Dec, 2014 - Comments: 1

[getkc id="10" comment="Functional Verification"] has been powered by tools that require hardware to look like the kinds of systems that were being designed two decades ago. Those limitations are putting chips at risk and a new approach to the problem is long overdue. Semiconductor Engineering sat down with Frank Schirrmeister, group director, product marketing for System Development Suite at [... » read more

Hybrid Verification: The Only Way Forward
By Brian Bailey - 15 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

Security Risks Grow Worse
By Ed Sperling - 09 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss security issues for connected devices with Marc Canel, vice president of security at [getentity id="22186" comment="ARM"]; Paul Kocher, president and chief scientist for the Cryptography Research division of [getentity id="22671" e_name="Rambus"]; Michael Poitner, global segment marketing manager at [getentity id="22499" e_name="NXP"]; Felix Baum, h... » read more

Architecting For Optimal Interface IP Integration
By Ann Mutschler - 04 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the design and integration of complex interface IP with Ty Garibay, VP of engineering at Altera; Brian Daellenbach, president of Northwest Logic; Frank Ferro, senior director of product management for memory and interface IP at Rambus; Saman Sadr, director of analog design at Semtech; and Navraj Nandra, senior director of marketing for analog/mixed ... » read more

Virtual Prototyping Takes Off
By Ed Sperling - 03 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="104" kc_name="virtual prototyping"] with Barry Spotts, senior core competency FAE for fabric and tools at [getentity id="22186" comment="ARM"]; Vasan Karighattam, senior director of architecture for SoC and SSW engineering at [getentity id="22664" e_name="Open-Silicon"]; Tom De Schutter, senior product marketing manager for Virtualizer So... » read more

Hybrid Verification: The Only Way Forward
By Brian Bailey - 01 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

Virtual Prototyping Takes Off
By Ed Sperling - 25 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss [getkc id="104" kc_name="virtual prototyping"] with Barry Spotts, senior core competency FAE for fabric and tools at [getentity id="22186" comment="ARM"]; Vasan Karighattam, senior director of architecture for SoC and SSW engineering at [getentity id="22664" e_name="Open-Silicon"]; Tom De Schutter, senior product marketing manager for Virtualizer S... » read more

Filling In The Gaps For Mixed-Signal Verification
By Ann Mutschler - 24 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss mixed-signal verification with Haiko Morgenstern, Mixed-Signal Verification Group Staff Engineer at Infineon; Dr. Gernot Koch, CAD Manager at Micronas; Pierluigi Daglio, AMS Design Verification Flows Manager at STMicroelectronics; and Helene Thibieroz, AMS marketing manager at [getentity id="22035" e_name="Synopsys"]. What follows are excerpts of th... » read more

Hybrid Verification: The Only Way Forward
By Brian Bailey - 20 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="10" kc_name=" functional verification"]. The inability of RTL [getkc id="11" kc_name="simulation"] to keep up with verification needs is causing rapid change in the industry. Taking part in the discussion are Harry Foster, chief scientist at [getentity id="22017" e_name="Mentor Graphics"]; Janick Bergeron, fe... » read more

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