Design Rules Explode At New Nodes

By Ed Sperling - 17 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down changing design rules with Sergey Shumarayev, senior director of custom IP design at Altera; Luigi Capodieci, R&D fellow at [getentity id="22819" comment="GlobalFoundries"]; Michael White, director of product marketing for Calibre Physical Verification at [getentity id="22017" e_name="Mentor Graphics"], and Coby Zelnik, CEO of [getentity id="22478" e_name=... » read more

Are Models Holding Back New Methodologies?

By Brian Bailey - 11 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the industry for [getkc id="101" kc_name="modeling"] at abstractions above [getkc id="49" kc_name="RTL"], a factor which has delayed adoption of [getkc id="104" kn_name="virtual prototypes"] and the proliferation of system-level design and hardware/software codesign. Taking part in the discussion were Frank Schirrmeister, group director... » read more

Virtual Prototyping Takes Off

By Ed Sperling - 06 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down with Barry Spotts, senior core competency FAE for fabric and tools at [getentity id="22186" comment="ARM"]; Vasan Karighattam, senior director of architecture for SoC and SSW engineering at [getentity id="22664" e_name="Open-Silicon"]; Tom De Schutter, senior product marketing manager for Virtualizer Solutions at [getentity id="22035" e_name="Synopsys"]; Larry... » read more

Design Rules Explode At New Nodes

By Ed Sperling - 03 Nov, 2014 - Comments: 0

Filling In The Gaps For Mixed-Signal Verification

By Ann Mutschler - 31 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss mixed-signal verification with Haiko Morgenstern, Mixed-Signal Verification Group Staff Engineer at Infineon; Dr. Gernot Koch, CAD Manager at Micronas; Pierluigi Daglio, AMS Design Verification Flows Manager at STMicroelectronics; and Helene Thibieroz, AMS marketing manager at [getentity id="22035" comment="Synopsys"]. What follows are excerpts of t... » read more

Are Models Holding Back New Methodologies?

By Brian Bailey - 30 Oct, 2014 - Comments: 1

Memory Directions Uncertain

By Brian Bailey - 28 Oct, 2014 - Comments: 1

Semiconductor Engineering sat down with a panel of experts to find out what is happening in world of memories. Taking part in the discussion are [getperson id="11073" comment="Charlie Cheng"], chief executive officer at [getentity id="22135" e_name="Kilopass Technology"]; Navraj Nandra, senior director of marketing for Analog/Mixed signal IP, embedded memories and logic libraries at [getentity ... » read more

Securing The IoT

By Ed Sperling - 27 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss whether the [getkc id="76" comment="Internet of Things"] will be secure enough, or whether it will create new security issues, with Sami Nassar, general manager of [getentity id="22499" comment="NXP Semiconductor"]; Oleg Logvinov, director for special assignments at [getentity id="22331" comment="STMicroelectronics"]; and Lawrence Loh, application e... » read more

Filling In The Gaps For Mixed-Signal Verification

By Ann Mutschler - 24 Oct, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss mixed-signal [getkc id="10" kc_name="Verification"] with Haiko Morgenstern, Mixed-Signal Verification Group Staff Engineer at Infineon; Dr. Gernot Koch, CAD Manager at Micronas; Pierluigi Daglio, AMS Design Verification Flows Manager at STMicroelectronics; and Helene Thibieroz, AMS marketing manager at [getentity id="22035" comment="Synopsys"]. What... » read more

Are Models Holding Back New Methodologies

By Brian Bailey - 23 Oct, 2014 - Comments: 0

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Round Tables

category: IoT, Security & Automotive

Design Rules Explode At New Nodes

Are Models Holding Back New Methodologies?

Virtual Prototyping Takes Off

Design Rules Explode At New Nodes

Filling In The Gaps For Mixed-Signal Verification

Are Models Holding Back New Methodologies?

Memory Directions Uncertain

Securing The IoT

Filling In The Gaps For Mixed-Signal Verification

Are Models Holding Back New Methodologies