category: Special Reports

category: IoT, Security & Automotive

The Controversial Spec
By Ann Mutschler - 11 Jul, 2013 - Comments: 0

By Ann Steffora Mutschler Design sophistication and complexity has made it increasingly difficult to fully specify the expected behavior of a block in an SoC, but this is necessary for design and verification teams. How do you write a “good” and “complete” specification of functionality? It turns out that the discussion of defining what a good and complete specification is and how t... » read more

Inside A 450mm Metrology Consortium
By Mark LaPedus - 20 Jun, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 450mm metrology challenges with Menachem Shoval, a former manufacturing executive at Intel and chairman of the Metro450 consortium. The Israeli-based consortium is developing metrology technology for the next-generation, 450mm wafer size. The group consists of Intel, Applied Materials, Jordan Valley, Nanomotion, Nov... » read more

Scaling The Lowly SRAM
By Mark LaPedus - 05 Jun, 2013 - Comments: 0

By Mark LaPedus Chipmakers face a multitude of challenges at the 20nm logic node and beyond, including the task of cramming more functions on the same chip without compromising on power and performance. There is one major challenge that is often overlooked in the equation—scaling the lowly static RAM (SRAM). In one key application, SRAM is the component used to make on-chip cache memories... » read more

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