category: Design & Verification

category: IoT, Security & Automotive

Overview Of Printed And Flexible Electronics: Technology Fundamentals, Design And Practical Applications
By Technical Paper Link - 07 May, 2025 - Comments: 0

A new technical paper titled "Computing with Printed and Flexible Electronics" was published by researchers at Karlsruhe Institute of Technology, Pragmatic Semiconductor Ltd and University of Patras. Abstract "Printed and flexible electronics (PFE) have emerged as the ubiquitous solution for application domains at the extreme edge, where the demands for low manufacturing and operational cos... » read more

Benefits Of Memory-Centric Computing (ETH Zurich)
By Technical Paper Link - 06 May, 2025 - Comments: 0

A new technical paper titled "Memory-Centric Computing: Solving Computing's Memory Problem" was published by researchers at ETH Zurich. Abstract "Computing has a huge memory problem. The memory system, consisting of multiple technologies at different levels, is responsible for most of the energy consumption, performance bottlenecks, robustness problems, monetary cost, and hardware real esta... » read more

Real-time Electrostatic Discharge (ESD) Monitoring Detector For Semiconductor Manufacturing
By Technical Paper Link - 05 May, 2025 - Comments: 0

A new technical paper titled "Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection" was published by researchers at National Yang Ming Chiao Tung University. Abstract "Integrated circuits are susceptible to electrostatic discharge (ESD) events. Real-time detection and alerting of ESD events in semiconductor manufacturing e... » read more

Inference Framework For Deployment Challenges of Large Generative Models On GPUs (Google)
By Technical Paper Link - 03 May, 2025 - Comments: 0

A new technical paper titled "Scaling On-Device GPU Inference for Large Generative Models" was published by researchers at Google and Meta Platforms. Abstract "Driven by the advancements in generative AI, large machine learning models have revolutionized domains such as image processing, audio synthesis, and speech recognition. While server-based deployments remain the locus of peak perform... » read more

Optimizing End-to-End Communication And Workload Partitioning In MCM Accelerators (Georgia Tech)
By Technical Paper Link - 03 May, 2025 - Comments: 0

A new technical paper titled "MCMComm: Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules" was published by researchers at Georgia Tech. Abstract "Increasing AI computing demands and slowing transistor scaling have led to the advent of Multi-Chip-Module (MCMs) based accelerators. MCMs enable cost-effective scalability, higher yield, and modular reuse by par... » read more

Inter-Chiplet Interconnect Topologies On Organic And Glass Substrates
By Technical Paper Link - 29 Apr, 2025 - Comments: 0

A new technical paper titled "FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates" was published by researchers at ETH Zurich. Abstract "Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substr... » read more

On-Chiplet Framework for Verifying Physical Security and Integrity of Adjacent Chiplets
By Technical Paper Link - 29 Apr, 2025 - Comments: 0

A new technical paper titled "ChipletQuake: On-die Digital Impedance Sensing for Chiplet and Interposer Verification" was published by researchers at Worcester Polytechnic Institute. Abstract "The increasing complexity and cost of manufacturing monolithic chips have driven the semiconductor industry toward chiplet-based designs, where smaller and modular chiplets are integrated onto a singl... » read more

A Survey Of Digital Twins and Other Prototyping Technologies for Vehicles
By Technical Paper Link - 26 Apr, 2025 - Comments: 0

A new technical paper titled "Digital Twin Technologies for Vehicular Prototyping: A Survey" was published by researchers at Central Michigan University and University of Florida. Abstract "Digital Twin (DT) technology is widely regarded as one of the most promising tools for industry development, demonstrating substantial application across numerous cyber-physical systems. Gradually, this ... » read more

Challenges of Chiplet Placement And Routing Optimization (KAIST)
By Technical Paper Link - 23 Apr, 2025 - Comments: 0

A new technical paper titled "Advanced Chiplet Placement and Routing Optimization considering Signal Integrity" was published by researchers at KAIST. Abstract: "This article addresses the critical challenges of chiplet placement and routing optimization in the era of advanced packaging and heterogeneous integration. We present a novel approach that formulates the problem as a signal integr... » read more

GenAI for Analog IC Design (McMaster University)
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "Generative AI for Analog Integrated Circuit Design: Methodologies and Applications" was published by researchers at McMaster University. Abstract "Electronic Design Automation (EDA) in analog Integrated Circuits (ICs) has been the focus of extensive research; however, unlike its digital counterpart, it has not achieved widespread adoption. In this systematic re... » read more

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