category: Manufacturing

category: IoT, Security & Automotive

Overview Of Printed And Flexible Electronics: Technology Fundamentals, Design And Practical Applications
By Technical Paper Link - 07 May, 2025 - Comments: 0

A new technical paper titled "Computing with Printed and Flexible Electronics" was published by researchers at Karlsruhe Institute of Technology, Pragmatic Semiconductor Ltd and University of Patras. Abstract "Printed and flexible electronics (PFE) have emerged as the ubiquitous solution for application domains at the extreme edge, where the demands for low manufacturing and operational cos... » read more

A Route For More Efficient SOT-MRAM Designs (NTU, TSMC)
By Technical Paper Link - 06 May, 2025 - Comments: 0

A new technical paper titled "Efficient Magnetization Switching via Orbital-to-Spin Conversion in Cr/W-Based Heterostructures" by researchers at National Taiwan University and TSMC. Abstract "A highly efficient spin–orbit torque (SOT) switching mechanism is crucial for the realization of practical SOT magnetic random-access memory (MRAM). This study proposes a Cr/W-based spin current sour... » read more

Real-time Electrostatic Discharge (ESD) Monitoring Detector For Semiconductor Manufacturing
By Technical Paper Link - 05 May, 2025 - Comments: 0

A new technical paper titled "Real-Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection" was published by researchers at National Yang Ming Chiao Tung University. Abstract "Integrated circuits are susceptible to electrostatic discharge (ESD) events. Real-time detection and alerting of ESD events in semiconductor manufacturing e... » read more

Inter-Chiplet Interconnect Topologies On Organic And Glass Substrates
By Technical Paper Link - 29 Apr, 2025 - Comments: 0

A new technical paper titled "FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates" was published by researchers at ETH Zurich. Abstract "Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. These substr... » read more

Differences In The Lithographic Impact Of Particles On The Pellicle Surface Depending On Type Of EUV Mask Pattern
By Technical Paper Link - 25 Apr, 2025 - Comments: 0

A new technical paper titled "Impact of Sn Particle-Induced Mask Diffraction on EUV Lithography Performance Across Different Pattern Types" was published by Hanyang University and Paul Scherrer Institute. Abstract "This study investigates the differences in the lithographic impact of particles on the pellicle surface depending on the type of extreme ultraviolet (EUV) mask pattern. Using a... » read more

Board-Level Packaging Method For Device Encapsulation To Enable Water Immersion Cooling
By Technical Paper Link - 14 Apr, 2025 - Comments: 0

A new technical paper titled "Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling" was published by researchers at University of Illinois, Urbana, University of Arkansas and UC Berkeley. Abstract "Power densification is making thermal design a key step in the development of future electrical devices. Systems such as data centers and electric vehicl... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Scalable Approach For Fabricating Sub-10nm Nanogaps
By Technical Paper Link - 07 Apr, 2025 - Comments: 0

A new technical paper titled "A progressive wafer scale approach for Sub-10 nm nanogap structures" was published by researchers at Seoul National University, Chung-Ang University, Mohammed VI Polytechnic University and Ulsan National Institute of Science and Technology. "We have advanced the atomic layer lithography method into an efficient, scalable approach for fabricating sub-10 nm nanoga... » read more

Thermal Slip Length at a L/S Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer (Caltech)
By Technical Paper Link - 04 Apr, 2025 - Comments: 0

A new technical paper titled "Thermal Slip Length at a Liquid/Solid Interface: Power Law Relations From Spatial and Frequency Attributes of the Contact Layer" was published by researchers at California Institute of Technology, , T. J. Watson Sr. Laboratories of Applied Physics. Abstract "Specialty integrated chips for power intensive tasks like artificial intelligence generate so much heat ... » read more

Strategies For Reducing The Effective GaN/Diamond TBR
By Technical Paper Link - 30 Mar, 2025 - Comments: 0

A new technical paper titled "Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond Electronics Applications" was published by researchers at University of Bristol, Cardiff University and Akash Systems. Abstract "GaN high electron mobility transistors (HEMTs) on SiC substrates are the highest performing commercially available transistors for high-power, hi... » read more

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