category: Manufacturing

category: IoT, Security & Automotive

Superconducting Qubits Made Using Industry-Standard, Advanced Semiconductor Manufacturing (imec, KU Leuven)
By Technical Paper Link - 25 Mar, 2024 - Comments: 0

A new technical paper titled "High-coherence superconducting qubits made using industry-standard, advanced semiconductor manufacturing" was published by researchers at imec and KU Leuven. Abstract: "The development of superconducting qubit technology has shown great potential for the construction of practical quantum computers. As the complexity of quantum processors continues to grow, the ... » read more

U.S. Strategy on Microelectronics Research
By Technical Paper Link - 19 Mar, 2024 - Comments: 0

The U.S. government released a 61 page report titled "National Strategy on Microelectronics Research" by the Subcommittee On Microelectronics Leadership, Committee on Homeland and National Security of the National Science and Technology Council. The report states four goals guiding the agency's efforts in microelectronics research: "Goal 1. Enable and accelerate research advances for futu... » read more

Band-To-Band Tunneling And Negative Differential Resistance in Heterojunctions Built Entirely Using 2D Materials
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A technical paper titled "Electrical characterization of multi-gated WSe2 /MoS2 van der Waals heterojunctions" was published by researchers at Helmholtz-Zentrum Dresden Rossendorf (HZDR), TU Dresden, National Institute for Materials Science (Japan) and NaMLab gGmbH. Abstract "Vertical stacking of different two-dimensional (2D) materials into van der Waals heterostructures exploits the pr... » read more

Environmental Impact of Semiconductor Manufacturing (ORNL)
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A  technical paper titled "Cleaner Chips: Decarbonization in Semiconductor Manufacturing" was published by researchers at Oak Ridge National Laboratory (ORNL) / UT-Battelle. Abstract: "The growth of the information and communication technology sector has vastly accelerated in recent decades because of advancements in digitalization and Artificial Intelligence (AI). Scope 1, 2, and 3 gree... » read more

UCIe-3D: SiP Architectures With Advanced 3D Packaging With Shrinking Bump Pitches (Intel)
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A technical paper titled “High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express” was published by researchers at Intel. Abstract: "Universal chiplet interconnect express (UCIe) is an open industry standard interconnect for a chiplet ecosystem in which chiplets from multiple suppliers can be packaged together. The UCIe 1.0... » read more

Lowering The Computational Cost of Simulation (DOE, Princeton)
By Technical Paper Link - 05 Mar, 2024 - Comments: 0

A technical paper titled “Accuracy of the explicit energy-conserving particle-in-cell method for under-resolved simulations of capacitively coupled plasma discharges” was published by researchers at Princeton University. Abstract: "The traditional explicit electrostatic momentum-conserving particle-in-cell algorithm requires strict resolution of the electron Debye length to deliver numeri... » read more

The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization 
By Technical Paper Link - 27 Feb, 2024 - Comments: 0

A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer co-optimization” was published by researchers at D2S and Micron. Abstract: "Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patte... » read more

Performing Multiple, Simultaneous Depositions In A High-Throughput, Multiplexing ALD/MLD-Style Reactor
By Technical Paper Link - 22 Feb, 2024 - Comments: 0

A technical paper titled “High throughput multiplexing reactor design for rapid screening of atomic/molecular layer deposition processes” was published by researchers at University of Washington. Abstract: "An approach is demonstrated for performing multiple, simultaneous depositions in a high-throughput, multiplexing atomic layer deposition/molecular layer deposition (ALD/MLD)-style reac... » read more

CMOS-Compatible, On-Chip, Compact And Wideband Nanoacoustic Pass-Band Filters For 5G And 6G
By Technical Paper Link - 22 Feb, 2024 - Comments: 0

A technical paper titled “Compact and wideband nanoacoustic pass-band filters for future 5G and 6G cellular radios” was published by researchers at Northeastern University. Abstract: "Over recent years, the surge in mobile communication has deepened global connectivity. With escalating demands for faster data rates, the push for higher carrier frequencies intensifies. The 7–20 GHz ran... » read more

Impact of Scaling and BEOL Technology Solutions At The 7nm Node On MRAM
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “Impact of Technology Scaling and Back-End-of-the-Line Technology Solutions on Magnetic Random-Access Memories” was published by researchers at Georgia Institute of Technology. Abstract: "While magnetic random-access memories (MRAMs) are promising because of their nonvolatility, relatively fast speeds, and high endurance, there are major challenges in adopting the... » read more

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