category: Materials

category: IoT, Security & Automotive

Estimating the Embedded Gate Resistance to Reproduce SiC MOSFET Circuit Performance (ROHM)
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A technical paper titled “Improved Scheme for Estimating the Embedded Gate Resistance to Reproduce SiC MOSFET Circuit Performance” was published by researchers at ROHM Company. Abstract: "The intrinsic gate resistance ( Rg_in) , which is a novel resistance factor embedded in transistors, was determined for silicon carbide (SiC) metal–oxide–semiconductor field-effect transistors (MOSFE... » read more

Meeting The Material Challenges Of Nano-CMOS Electronics
By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “Shockley-Read-Hall recombination and trap levels in In0.53 Ga0.47As point defects from first principles” was published by researchers at University of Glasgow and Synopsys Denmark. Abstract: "We present charge state transition levels of 23 intrinsic defects and dopant substitutions in the compound III-V semiconductor In0.53 Ga0.47 As, calculated with density func... » read more

Noise Parameter Survey Of Millimeter Wave GaN HEMT Technologies
By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “A Survey of GaN HEMT Technologies for Millimeter-Wave Low Noise Applications” was published by researchers at Wright-Patterson AFB, Teledyne Scientific, HRL Laboratories, BAE Systems, Pseudolithic, Northrop Grumman Corporation, and University of California Santa Barbara. "This article presents a set of measured benchmarks for the noise and gain performance of si... » read more

Integration Of Layered Semimetals With Conventional CMOS Platform
By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Layered semimetal electrodes for future heterogeneous electronics” was published by researchers at IIT Madras and Indian Institute of Science Education and Research. Abstract: "Integration of the emerging layered materials with the existing CMOS platform is a promising solution to enhance the performance and functionalities of the future CMOS based integrated cir... » read more

Friction Between Single Layer Graphene And An Atomic Force Microscope Tip
By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Dynamically tuning friction at the graphene interface using the field effect” was published by researchers at University of Illinois Urbana-Champaign and University of California Irvine. Abstract: "Dynamically controlling friction in micro- and nanoscale devices is possible using applied electrical bias between contacting surfaces, but this can also induce unwant... » read more

Neuromorphic Artificial Synaptic Device Combining Memristor Arrays With Copper Iodide
By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Charge-Mediated Copper-Iodide-Based Artificial Synaptic Device with Ultrahigh Neuromorphic Efficacy” was published by researchers at University of Glasgow, City University of Hong Kong, and Hong Kong Metropolitan University. Abstract: "In the realm of artificial intelligence, ultrahigh-performance neuromorphic computing plays a significant role in executing multi... » read more

A Perovskite-Derivative Nickelate Offering More Durable, Sustainable Multi-Level Non-Volatile Phase Change Memory
By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Thermally Reentrant Crystalline Phase Change in Perovskite-Derivative Nickelate Enabling Reversible Switching of Room-Temperature Electrical Resistivity” was published by researchers at Tohoku University and University of Tsukuba. Abstract: "Reversible switching of room-temperature electrical resistivity due to crystal-amorphous transition is demonstrated in vari... » read more

Wafer-Scale CMOS-Integrated GFET Arrays With High Yield And Uniformity Designed For Biosensing Applications
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Wafer-Scale Graphene Field-Effect Transistor Biosensor Arrays with Monolithic CMOS Readout” was published by researchers at VTT Technical Research Centre of Finland and Graphenea Semiconductor SLU. Abstract: "The reliability of analysis is becoming increasingly important as point-of-care diagnostics are transitioning from single-analyte detection toward multiplex... » read more

A New Layered Structure With 2D Material That Exhibits A Unique Transfer Of Energy And Charge
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Excitation-Dependent High-Lying Excitonic Exchange via Interlayer Energy Transfer from Lower-to-Higher Bandgap 2D Material” was published by researchers at University of Warsaw, Brookhaven National Laboratory, and National Institute for Materials Science (Japan). Abstract: "High light absorption (∼15%) and strong photoluminescence (PL) emission in monolayer (1L... » read more

An Eco-Friendly Conductive Ink For Thin-Film Electronics
By Technical Paper Link - 06 Sep, 2023 - Comments: 0

A technical paper titled “Recyclable Thin-Film Soft Electronics for Smart Packaging and E-Skins” was published by researchers at Carnegie Mellon University and University of Coimbra. Abstract: Despite advances in soft, sticker-like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco-friendly conductive ink for thin-film... » read more

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