category: Materials

category: IoT, Security & Automotive

Co-Design View of Cross-Bar Based Compute-In-Memory
By Technical Paper Link - 15 Mar, 2023 - Comments: 0

A new review paper titled "Compute in-Memory with Non-Volatile Elements for Neural Networks: A Review from a Co-Design Perspective" was published by researchers at Argonne National Lab, Purdue University, and Indian Institute of Technology Madras. "With an over-arching co-design viewpoint, this review assesses the use of cross-bar based CIM for neural networks, connecting the material proper... » read more

Ferroelectric HEMT Reconfigurable Transistor (U. of Michigan)
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A new technical paper titled "Fully epitaxial, monolithic ScAlN/AlGaN/GaN ferroelectric HEMT" was published by researchers at University of Michigan. “We can make our ferroelectric HEMT reconfigurable,” That means it can function as several devices, such as one amplifier working as several amplifiers that we can dynamically control. This allows us to reduce the circuit area and lower the... » read more

Reducing Contact Resistance in Developing Transistors Based On 2D Materials
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A new technical paper titled "WS2 Transistors with Sulfur Atoms Being Replaced at the Interface: First-Principles Quantum-Transport Study" was published by researchers at National Yang Ming Chiao Tung University. Abstract "Reducing the contact resistance is one of the major challenges in developing transistors based on two-dimensional materials. In this study, we perform first-principles ... » read more

Large Area Synthesis of 2D Material Hexagonal Boron Nitride, Improving Device Characteristics of Graphene
By Technical Paper Link - 08 Mar, 2023 - Comments: 0

A new technical paper titled "Large-area synthesis and transfer of multilayer hexagonal boron nitride for enhanced graphene device arrays" was published by researchers at Kyushu University, National Institute of Advanced Industrial Science and Technology (AIST), and Osaka University. Abstract "Multilayer hexagonal boron nitride (hBN) can be used to preserve the intrinsic physical properti... » read more

Printed Electronics: Direct Flipchip Bonding of Ultra-Thin Chip On A Recently-Developed Stretchable Substrate
By Technical Paper Link - 05 Mar, 2023 - Comments: 0

A new technical paper titled "Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation" was published by researchers at Silicon Austria Labs and Institute for Smart Systems Technologies. Abstract "Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-... » read more

Fabricating Multi-Walled Carbon Nanotubes On Plastic Film
By Technical Paper Link - 04 Mar, 2023 - Comments: 0

A new technical paper titled "Direct formation of carbon nanotube wiring with controlled electrical resistance on plastic films" was published by researchers at Tokyo University of Science. The paper states, "we have developed a simple method to fabricate multi-walled carbon nanotube (MWNT) wiring on a plastic film at room temperature under atmosphere pressure. By irradiating a MWNT thin fil... » read more

Solid-State Electrochemical Thermal Transistor Without Using Liquid
By Technical Paper Link - 24 Feb, 2023 - Comments: 0

A new technical paper titled "Solid-State Electrochemical Thermal Transistors" was published by researchers at Hokkaido University, Pusan National University, and the University of Tokyo. Abstract "Thermal transistors that electrically control heat flow have attracted growing attention as thermal management devices and phonon logic circuits. Although several thermal transistors are demons... » read more

Advanced Packaging for High-Bandwidth Memory: Influences of TSV size, TSV Aspect Ratio And Annealing Temperature
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A technical paper titled "Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications" was published by researchers at National Yang Ming Chiao Tung University. Abstract: "The stress of TSV with different dimensions under annealing condition has been investigated. Since the application of TSV and bonding technology has demonstrated a promising approach for ... » read more

ILP-Based Router for Wire-Bonding FBGA Packaging Design
By Technical Paper Link - 13 Feb, 2023 - Comments: 0

A new technical paper titled "ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design" was written by researchers at National Taiwan University of Science and Technology. "In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-depende... » read more

Nanoscale (5nm) Ferroelectric Semiconductor (University of Michigan)
By Technical Paper Link - 08 Feb, 2023 - Comments: 0

A new technical paper titled "Thickness scaling down to 5 nm of ferroelectric ScAlN on CMOS compatible molybdenum grown by molecular beam epitaxy" was published by researchers at University of Michigan, with DARPA funding. "Ferroelectric semiconductors stand out from others because they can sustain an electrical polarization, like the electric version of magnetism. But unlike a fridge magn... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy