category: Optoelectronics / Photonics

category: IoT, Security & Automotive

Integration of High-Density Polymer Waveguides With Silicon Photonics for CPO (imec, Ghent)
By Technical Paper Link - 03 Jun, 2025 - Comments: 0

A technical paper titled "Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics" was published by researchers at imec and Ghent University. Abstract "Co-Packaged Optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coup... » read more

Roadmap for AI HW Development, With The Role of Photonic Chips In Supporting Future LLMs (CUHK, NUS, UIUC, Berkeley)
By Technical Paper Link - 01 Jun, 2025 - Comments: 0

A new technical paper titled "What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips" was published by researchers at The Chinese University of Hong Kong, National University of Singapore, University of Illinois Urbana-Champaign and UC Berkeley. Abstract "Large language models (LLMs) are rapidly pushing the limits of contemporary computing hardware. For example, t... » read more

Photonic-SRAM Bitcell for High-Speed On-Chip Photonic Memory and Compute Systems (UW, USC, GF)
By Technical Paper Link - 04 Apr, 2025 - Comments: 0

A new technical paper titled "Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for High-Speed On-Chip Photonic Memory and Compute Systems" was published by researchers at University of Wisconsin–Madison, USC and GlobalFoundries. Abstract "In this work, we propose a novel differential photonic static random access memory (pSRAM) bitcell design using fabri... » read more

3D Photonic Integration For Ultra-Low-Energy, High-Bandwidth Interchip Data Links (Columbia et al.)
By Linda Christensen - 23 Mar, 2025 - Comments: 0

A new technical paper titled "Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links" was published by researchers at Columbia University, Cornell University, Air Force Research Laboratory Information Directorate and Dartmouth College. Abstract "Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by ... » read more

Energy-Efficient Scalable Silicon Photonic Platform For AI Accelerator HW
By Technical Paper Link - 12 Mar, 2025 - Comments: 0

A new technical paper titled "Large-Scale Integrated Photonic Device Platform for Energy-Efficient AI/ML Accelerators" was published by researchers at HP Labs, IIT Madras, Microsoft Research and University of Michigan. Abstract "The convergence of deep learning and Big Data has spurred significant interest in developing novel hardware that can run large artificial intelligence (AI) workload... » read more

The Optical Implementation of Backpropagation (Oxford, Lumai)
By Technical Paper Link - 07 Mar, 2025 - Comments: 0

A technical paper titled "Training neural networks with end-to-end optical backpropagation" was published by researchers at University of Oxford and Lumai Ltd. Abstract "Optics is an exciting route for the next generation of computing hardware for machine learning, promising several orders of magnitude enhancement in both computational speed and energy efficiency. However, reaching the full... » read more

High-Temperature Nonreciprocal Thermal Radiative Properties From Semiconductors (U. Houston, Caltech, UW-Madison)
By Technical Paper Link - 12 Feb, 2025 - Comments: 0

A new technical paper titled "High-Temperature Strong Nonreciprocal Thermal Radiation from Semiconductors" was published by University of Houston, California Institute of Technology and University of Wisconsin-Madison. Abstract "Nonreciprocal thermal emitters that break the conventional Kirchhoff's law allow independent control of emissivity and absorptivity and promise exciting new funct... » read more

3D Integration And Test Results From TSV-Processed Chips (CERN et al.)
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "3D integration of pixel readout chips using Through-Silicon-Vias" was published by researchers at CERN, IZM Fraunhofer and University of Geneva. Abstract "Particle tracking and imaging detectors are becoming increasingly complex, driven by demands for densely integrated functionality and maximal sensitive area. These challenging requirements can be met using 3D... » read more

Vertical AlGaN Heterostructures For Integrated Photonics
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "AlGaN/AlN heterostructures: an emerging platform for integrated photonics" was published by researchers at Humboldt-Universität zu Berlin and Ferdinand-Braun-Institut (FBH). Abstract "We introduce a novel material for integrated photonics and investigate aluminum gallium nitride (AlGaN) on aluminum nitride (AlN) templates as a platform for developing reconfig... » read more

Loss Processes in Electrochemically Charged Semiconductor Nanocrystal Films (TU Delft)
By Technical Paper Link - 16 Jan, 2025 - Comments: 0

A new technical paper titled "Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of Semiconductor Nanomaterials" was published by researchers at Delft University of Technology. Abstract "Electrochemical charging of films of semiconductor nanocrystals (NCs) allows precise control over their Fermi level and opens up new possibilities for use of semiconductor NC... » read more

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