category: Technical Papers

category: IoT, Security & Automotive

New Class Of Materials With Increased Band Gap (U. of Minnesota, Caltech)
By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Deep-ultraviolet transparent conducting SrSnO3 via heterostructure design" was published by researchers at University of Minnesota–Twin Cities and Caltech. The researchers "looked at creating a new class of materials with increased “band gap,” enhancing both transparency and conductivity. The new material is a transparent conducting oxide, created with a s... » read more

Effectiveness of Hardware Fuzzing In Detecting Memory Vulnerabilities
By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Fuzzerfly Effect: Hardware Fuzzing for Memory Safety" was published by researchers at Technical University of Darmstadt, Texas A&M University and Delft University of Technology. Abstract: "Hardware-level memory vulnerabilities severely threaten computing systems. However, hardware patching is inefficient or difficult post-fabrication. We investigate the eff... » read more

Two Silicon Switches Driven Both Thermally and Electrically With Ultra-Low-Crosstalk (Cambridge)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "Ultra-low-crosstalk Silicon Switches Driven Thermally and Electrically" was published by researchers at University of Cambridge and GlitterinTech Limited. Abstract "Silicon photonic switches are widely considered as a cost-effective solution for addressing the ever-growing data traffic in datacenter networks, as they offer unique advantages such as low power co... » read more

CXL-Based Heterogeneous Systems: How to Optimize and Future Directions (UCSD, Samsung, SK Hynix)
By Technical Paper Link - 06 Nov, 2024 - Comments: 0

A new technical paper titled "The Hitchhiker’s Guide to Programming and Optimizing CXL-Based Heterogeneous Systems" was published by researchers at UC San Diego, Samsung, SK hynix. Abstract "We present a thorough analysis of the use of CXL-based heterogeneous systems. We built a cluster of server systems that combines different vendor's CPUs and various types of CXL devices. We further ... » read more

Visualization of Photoexcited Charges Moving Across the Interface of Si/Ge
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A technical paper titled "Imaging hot photocarrier transfer across a semiconductor heterojunction with ultrafast electron microscopy" was published by researchers at UC Santa Barbara and UCLA. "In this work, we apply scanning ultrafast electron microscopy to provide a holistic view of photoexcited charge dynamics in a Si/Ge heterojunction. We find that the built-in potential and the band off... » read more

Energy Storage: Properties of Barium Titanate (Harvey Mudd)
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A technical paper titled "Understanding surfaces and interfaces in nanocomposites of silicone and barium titanate through experiments and modeling" was published by researchers at Harvey Mudd College, Sandia National Lab and Air Force Research Laboratory. Abstract "Barium titanate (BTO) is a ferroelectric perovskite used in electronics and energy storage systems because of its high dielectr... » read more

Review of Advances in 3D integration of 2D Neuromorphic Electronics, Materials to Systems
By Technical Paper Link - 05 Nov, 2024 - Comments: 0

A new technical paper titled "2D materials-based 3D integration for neuromorphic hardware" was published by researchers at  Seoul National University and University of Southern California. Find the technical paper here. November 2024. Kim, S.J., Lee, HJ., Lee, CH. et al. 2D materials-based 3D integration for neuromorphic hardware. npj 2D Mater Appl 8, 70 (2024). https://doi.org/10.10... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

Benchmark and Evaluation Framework For Characterizing LLM Performance In Formal Verification (UC Berkeley, Nvidia)
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "FVEval: Understanding Language Model Capabilities in Formal Verification of Digital Hardware" was published by researchers at UC Berkeley and NVIDIA. Abstract "The remarkable reasoning and code generation capabilities of large language models (LLMs) have spurred significant interest in applying LLMs to enable task automation in digital chip design. In particula... » read more

Pre-Silicon Verification Method Addressing Critical Aspects of Speculative Execution Vulnerability Detection
By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Lost and Found in Speculation: Hybrid Speculative Vulnerability Detection" was published by researchers at Technical University of Darmstadt and Texas A&M University. "We introduce Specure, a novel pre-silicon verification method composing hardware fuzzing with Information Flow Tracking (IFT) to address speculative execution leakages. Integrating IFT enables two... » read more

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