category: Technical Papers

category: IoT, Security & Automotive

Formally Modeling and Verifying CXL Cache Coherence (Imperial College London)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Formalising CXL Cache Coherence" was published by researchers at Imperial College London. Abstract "We report our experience formally modelling and verifying CXL.cache, the inter-device cache coherence protocol of the Compute Express Link standard. We have used the Isabelle proof assistant to create a formal model for CXL.cache based on the prose English spec... » read more

Open-Source, Chiplet-Compatible RISC-V Controller
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "ControlPULPlet: A Flexible Real-time Multi-core RISC-V Controller for 2.5D Systems-in-package" was published by researchers at ETH Zurich and University of Bologna. Abstract "The increasing complexity of real-time control algorithms and the trend toward 2.5D technology necessitate the development of scalable controllers for managing the complex, integrated oper... » read more

Review of Automatic EM Image Algorithms for Semiconductor Defect Inspection (KU Leuven, Imec)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Electron Microscopy-based Automatic Defect Inspection for Semiconductor Manufacturing: A Systematic Review" was published by researchers at KU Leuven and imec. Abstract: "In this review, automatic defect inspection algorithms that analyze Electron Microscope (EM) images of Semiconductor Manufacturing (SM) products are identified, categorized, and discussed. Thi... » read more

Energy Analysis: 2D and 3D Architectures with Systolic Arrays and CIM (Cornell)
By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs" was published by researchers at Cornell University. "In this paper, we investigate digital CIM (DCIM) macros and various 3D architectures to find the opportunity of increased energy efficiency compared to 2D structures. Moreover, we also investigated th... » read more

Mini Review of Photodetectors and Image Sensors: Materials and Fabrication
By Technical Paper Link - 19 Oct, 2024 - Comments: 0

A new technical paper titled "Image Sensors and Photodetectors Based on Low-Carbon Footprint Solution-Processed Semiconductors" was published by researchers at Cardiff University. Abstract "This mini-review explores the evolution of image sensors, essential electronic components increasingly integrated into daily life. Traditional manufacturing methods for image sensors and photodetectors, ... » read more

Physics-Based Efficient Device Model for Fe-TFTs (Univ. of Florida)
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "An efficient device model for ferroelectric thin-film transistors" was published by researchers at University of Florida. Abstract "Ferroelectric thin-film transistors (Fe-TFTs) have promising potential for flexible electronics, memory, and neuromorphic computing applications. Here, we report on a physics-based efficient device model for Fe-TFTs that effectivel... » read more

3D Device With BEOL-Compatible Channel And Physical Design for Efficient Double-Side Routing
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Omni 3D: BEOL-Compatible 3D Logic with Omnipresent Power, Signal, and Clock" was published by researchers at Stanford University, Intel Corporation, and Carnegie Mellon University. Abstract "This paper presents Omni 3D - a 3D-stacked device architecture that is naturally enabled by back-end-of-line (BEOL)-compatible transistors. Omni 3D arbitrarily interleaves ... » read more

Distributed Radar Signal Processing Utilizing A Sparse Array To Obfuscate The Data
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Signal processing architecture for a trustworthy 77GHz MIMO Radar" was published by researchers at Fraunhofer FHR, Ruhr University Bochum, and Wavesense Dresden GmbH. Abstract "Radar systems are used in safety critical applications in vehicles, so it is necessary to ensure their functioning is reliable and trustworthy. System-on-chip (SoC) radars, which are com... » read more

3D-Printed Logic Gates and Resettable Fuses, Via Material Extrusion (MIT)
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses" was published by researchers at MIT. "This work reports the first active electronics fully 3D-printed via material extrusion, i.e. one of the most accessible and versatile additive manufacturing processes. The technology is proof-of-concept demonstrated through the implementation of ... » read more

GPUs: Bandit Based Framework To Dynamically Reduce Energy Consumption
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "Online Energy Optimization in GPUs: A Multi-Armed Bandit Approach" was published by researchers at Illinois Institute of Technology, Argonne National Lab and Emory University. Abstract "Energy consumption has become a critical design metric and a limiting factor in the development of future computing architectures, from small wearable devices to large-scale lea... » read more

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