category: Technical Papers

category: IoT, Security & Automotive

A Survey Of Digital Twins and Other Prototyping Technologies for Vehicles
By Technical Paper Link - 26 Apr, 2025 - Comments: 0

A new technical paper titled "Digital Twin Technologies for Vehicular Prototyping: A Survey" was published by researchers at Central Michigan University and University of Florida. Abstract "Digital Twin (DT) technology is widely regarded as one of the most promising tools for industry development, demonstrating substantial application across numerous cyber-physical systems. Gradually, this ... » read more

Impact Of Cryogenic Temps On The Minimum-Operating Voltage Of 5nm FinFETs-Based SRAM (IIT, UC Berkeley et al)
By Technical Paper Link - 25 Apr, 2025 - Comments: 0

A new technical paper titled "An Investigation of Minimum Supply Voltage of 5nm SRAM from 300K down to 10K" was published by researchers at Indian Institute of Technology, UC Berkeley and Munich Institute of Robotics and Machine Intelligence. Abstract "In this article, we present a comprehensive study of the impact of cryogenic temperatures on the minimum-operating voltage (Vmin) of 5 nm ... » read more

Differences In The Lithographic Impact Of Particles On The Pellicle Surface Depending On Type Of EUV Mask Pattern
By Technical Paper Link - 25 Apr, 2025 - Comments: 0

A new technical paper titled "Impact of Sn Particle-Induced Mask Diffraction on EUV Lithography Performance Across Different Pattern Types" was published by Hanyang University and Paul Scherrer Institute. Abstract "This study investigates the differences in the lithographic impact of particles on the pellicle surface depending on the type of extreme ultraviolet (EUV) mask pattern. Using a... » read more

Challenges of Chiplet Placement And Routing Optimization (KAIST)
By Technical Paper Link - 23 Apr, 2025 - Comments: 0

A new technical paper titled "Advanced Chiplet Placement and Routing Optimization considering Signal Integrity" was published by researchers at KAIST. Abstract: "This article addresses the critical challenges of chiplet placement and routing optimization in the era of advanced packaging and heterogeneous integration. We present a novel approach that formulates the problem as a signal integr... » read more

Hardware Security: Assessment Method For Attacks Using Real-World Cases (TU Wien, TÜV Austria)
By Technical Paper Link - 23 Apr, 2025 - Comments: 0

A new technical paper titled "The Pains of Hardware Security: An Assessment Model of Real-World Hardware Security Attacks" was published by researchers at TU Wien and TÜV Austria. "We review some of the publicly known HW attacks that have occurred and propose an assessment scheme for the attacks and the defense on hardware," states the paper. Find the technical paper here. April 2025. ... » read more

HW-based Heterogeneous Memory Management for LLM Inferencing (KAIST, Stanford Unversity)
By Technical Paper Link - 22 Apr, 2025 - Comments: 0

A new technical paper titled "Hardware-based Heterogeneous Memory Management for Large Language Model Inference" was published by researchers at KAIST and Stanford University. Abstract "A large language model (LLM) is one of the most important emerging machine learning applications nowadays. However, due to its huge model size and runtime increase of the memory footprint, LLM inferences suf... » read more

Single Transistor Memory Cell C2RAM Based On FDSOI For Quantum And Neuromorphic
By Technical Paper Link - 15 Apr, 2025 - Comments: 0

A new technical paper titled "An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures" was published by researchers at Forschungszentrum Jülich, RWTH Aachen University and SOITEC. Abstract: "Efficient computing in cryogenic environments, including classical von Neumann, quantum, and neuromorphic systems, is poised to transform big data processing. The que... » read more

Board-Level Packaging Method For Device Encapsulation To Enable Water Immersion Cooling
By Technical Paper Link - 14 Apr, 2025 - Comments: 0

A new technical paper titled "Thermally Conductive Electrically Insulating Electronics Packaging for Water Immersion Cooling" was published by researchers at University of Illinois, Urbana, University of Arkansas and UC Berkeley. Abstract "Power densification is making thermal design a key step in the development of future electrical devices. Systems such as data centers and electric vehicl... » read more

ReRAM-Based, In-Memory Implementation Of Stochastic Computing
By Technical Paper Link - 14 Apr, 2025 - Comments: 0

A new technical paper titled "All-in-Memory Stochastic Computing using ReRAM" was published by researchers at TU Dresden, Center for Scalable Data Analytics and Artificial Intelligence (ScaDS.AI), Case Western Reserve University, University of Louisiana at Lafayette and Barkhausen Institut. Abstract "As the demand for efficient, low-power computing in embedded and edge devices grows, tradit... » read more

Pre-Silicon Hardware Trojans: Design, Benchmarking, Detection And Prevention (Sandia Labs)
By Technical Paper Link - 09 Apr, 2025 - Comments: 0

A new technical paper titled "A Survey on the Design, Detection, and Prevention of Pre-Silicon Hardware Trojans" was published by researchers at Sandia National Laboratories. "In this survey, we first highlight efforts in Trojan design and benchmarking, followed by a cataloging of seminal and recent works in Trojan detection and prevention and their accompanied metrics. Given the volume of l... » read more

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