category: Technical Papers

category: Auto, Security & Edge AI

High-NA EU Lithography: Extending The STCC Formula (Science Tokyo)
By Technical Paper Link - 06 May, 2026 - Comments: 0

A new technical paper, "Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in high-numerical-aperture extreme ultraviolet lithography" was published by researchers at Institute of Science Tokyo. This work is based on the paper presented at SPIE Advanced Lithography + Patterning 2026. "The polarization effect is not negli... » read more

A Detailed Evaluation of A Production Server With High-End MRDIMM Main Memory (BSC, Micron, Intel, UPC)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Performance and Energy Benefits of MRDIMMs," was published by researchers at Barcelona Supercomputing Center, Universitat Politecnica de Catalunya, Micron and Intel Corporation. Abstract "Multiplexed Rank DIMMs (MRDIMMs) have recently emerged as memory devices that enable higher bandwidth without increasing DRAM chip frequencies. This paper presents a detailed perf... » read more

GPU Power Prediction Tool for AI Workloads (MIT, IBM)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "EnergAIzer: Fast and Accurate GPU Power Estimation Framework for AI Workloads," was published by researchers at MIT and IBM Research. Abstract "As AI workloads drive increases in datacenter power consumption, accurate GPU power estimation is critical for proactive power management. However, existing power models face a scalability bottleneck not in the modeling tec... » read more

Pre-Silicon Verification and Validation Methodology Targeting Robust RISC-V Chip Designs (BSC)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Verification and Validation (V&V)-in-the-Loop for RISC-V Design: The Holistic Vision of BZL," was published by researchers at Barcelona Supercomputing Center. Abstract "The Barcelona Zetascale Lab (BZL) project aims to strengthening Europe's capacity in the design and manufacture of RISC-V based high-performance computing chips. In this context, we present a ho... » read more

Foundry-Compatible Grating Couplers Using an Inverse Design Framework (Yale)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Multimode grating couplers via foundry-compliant inverse design," was published by researchers at Yale University. Abstract "We apply a systematic inverse design approach to discover foundry-compliant, multilayer grating couplers that can efficiently couple a number of independent waves from free space to on-chip propagating modes. For visible- and near-infrared co... » read more

SDVs: Modular Drive Architecture Using Power-Packet-Based Sensorless Control (Kyoto U.)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Modular Drive Architecture for Software-defined Vehicles Enabled by Power-packet-based Sensorless Control," was published by researchers at Kyoto University. Abstract "The transition toward software-defined vehicles requires standardization and modularization of hardware decoupled from software, along with centralized electrical/electronic architectures. While elec... » read more

Replacing GPU Compute Dies With PNM-Enabled HBM Cubes For Long-Context Decode Attention (UCSD, Columbia, Yonsei U., NVIDIA, Samsung)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving," was published by researchers at UC San Diego, Columbia University, Yonsei University, NVIDIA, and Samsung. Abstract "All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA's Rubin GPU-LPU heterogeneous p... » read more

Understanding Why Drain-Current in GAAFETs Deviates from Thermionic Dependence at Negative Gate Voltages (Sandia National Lab, LIST)
By Technical Paper Link - 05 May, 2026 - Comments: 0

A new technical paper, "Gate-Drain Leakage Enhanced by Drain-Induced Dielectric Barrier Lowering in Gate-All-Around Field Effect Transistors," was published by researchers at Sandia National Laboratories and Luxembourg Institute of Science and Technology. Abstract "Gate-All-Around Field-Effect Transistors (GAAFETs), now entering high-volume production as successors to fin field-effect tra... » read more

Potential Route To Photonic FPCA Using NV Low-Loss Phase Change Material (Oxford)
By Technical Paper Link - 02 May, 2026 - Comments: 0

A new technical paper, "Nonvolatile photonic field-programmable coupler array," was published by researchers at University of Oxford. Abstract "Programmable photonic networks carry out universal unitary functions by independently operating on the amplitude and phase of guided light. Exploiting the reconfigurability and spatiospectral degrees of freedom of these systems, the majority of stat... » read more

Energy-Efficient Liquid Cooling for Advanced Semiconductor Packaging (KAIST)
By Technical Paper Link - 29 Apr, 2026 - Comments: 0

A new technical paper, "Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000," was published by researchers at KAIST. The study presents a CMOS-compatible manifold microchannel cooler that removes over 2,000 W/cm² using single-phase water at only 8 kPa pressure drop, achieving a record COP of 106,000—a significant improvement... » read more

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