category: Power & Performance

category: IoT, Security & Automotive

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Band-To-Band Tunneling And Negative Differential Resistance in Heterojunctions Built Entirely Using 2D Materials
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A technical paper titled "Electrical characterization of multi-gated WSe2 /MoS2 van der Waals heterojunctions" was published by researchers at Helmholtz-Zentrum Dresden Rossendorf (HZDR), TU Dresden, National Institute for Materials Science (Japan) and NaMLab gGmbH. Abstract "Vertical stacking of different two-dimensional (2D) materials into van der Waals heterostructures exploits the pr... » read more

TCAM-SSD: A Framework For In-SSD Associative Search Using NAND Flash Memory
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "TCAM-SSD: A Framework for Search-Based Computing in Solid-State Drives" was published by researchers at University of Illinois Urbana-Champaign, Carnegie Mellon University, Samsung Electronics and Sandia National Laboratories. Abstract "As the amount of data produced in society continues to grow at an exponential rate, modern applications are incurring signific... » read more

Reprogrammable Light-Based Processor (RMIT)
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "Programmable high-dimensional Hamiltonian in a photonic waveguide array" was published by researchers at RMIT University, ETH Zurich, Griffith University, Heriot-Watt University, University of Muenster Purdue University and others. Abstract "Waveguide lattices offer a compact and stable platform for a range of applications, including quantum walks, condensed m... » read more

Distributed Batteries Within a Heterogeneous 3D IC
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A new technical paper titled "On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits" was published by researchers at University of Florida (Gainesville) and Brookhaven National Lab. Abstract "Energy efficiency in digital systems faces challenges due to the constraints imposed by small-scale transistors. Moreover, the growing demand for portable consum... » read more

UCIe-3D: SiP Architectures With Advanced 3D Packaging With Shrinking Bump Pitches (Intel)
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A technical paper titled “High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express” was published by researchers at Intel. Abstract: "Universal chiplet interconnect express (UCIe) is an open industry standard interconnect for a chiplet ecosystem in which chiplets from multiple suppliers can be packaged together. The UCIe 1.0... » read more

Resistive Switching Analysis In Titanium Oxide-Based Memristors Including Surface Scanning Thermal Microscopy
By Technical Paper Link - 12 Mar, 2024 - Comments: 0

A technical paper titled “Thermal Compact Modeling and Resistive Switching Analysis in Titanium Oxide-Based Memristors” was published by researchers at Universidad de Granada, Leibniz-Institut für innovative Mikroelektronik, Universidad Politécnicade Madrid, University of Twente, King Abdullah University of Science and Technology (KAUST), and Universitat de Barcelona. Abstract: "Resist... » read more

An All-Optical General-Purpose CPU And Optical Computer Architecture (Akhetonics)
By Technical Paper Link - 11 Mar, 2024 - Comments: 0

A technical paper titled “An All-Optical General-Purpose CPU and Optical Computer Architecture” was published by researchers at Akhetonics. Abstract: "Energy efficiency of electronic digital processors is primarily limited by the energy consumption of electronic communication and interconnects. The industry is almost unanimously pushing towards replacing both long-haul, as well as local c... » read more

Ultrathin vdW Ferromagnet at Room Temperature (MIT)
By Technical Paper Link - 07 Mar, 2024 - Comments: 0

A technical paper titled “Current-induced switching of a van der Waals ferromagnet at room temperature” was published by researchers at Massachusetts Institute of Technology (MIT). Abstract: "Recent discovery of emergent magnetism in van der Waals magnetic materials (vdWMM) has broadened the material space for developing spintronic devices for energy-efficient computation. While there has... » read more

An Analytical EM Model For IC Shielding Against HW Attacks
By Technical Paper Link - 05 Mar, 2024 - Comments: 0

A technical paper titled “Refined Analytical EM Model of IC-Internal Shielding for Hardware-Security and Intra-Device Simulative Framework” was published by researchers at Bar-Ilan University and Rafael Defense Systems. Abstract: "Over the past two decades, the prominence of physical attacks on electronic devices, designed to extract confidential information, has surged. These attacks exp... » read more

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