category: Power & Performance

category: IoT, Security & Automotive

DeepSeek: Improving Language Model Reasoning Capabilities Using Pure Reinforcement Learning
By Technical Paper Link - 27 Jan, 2025 - Comments: 0

A new technical paper titled "DeepSeek-R1: Incentivizing Reasoning Capability in LLMs via Reinforcement Learning" was published by DeepSeek. Abstract: "We introduce our first-generation reasoning models, DeepSeek-R1-Zero and DeepSeek-R1. DeepSeek-R1-Zero, a model trained via large-scale reinforcement learning (RL) without supervised fine-tuning (SFT) as a preliminary step, demonstrates rema... » read more

Electronic and Transport Properties of Six TMD Heterostructures
By Technical Paper Link - 24 Jan, 2025 - Comments: 0

A new technical paper titled "Computational Assessment of I–V Curves and Tunability of 2D Semiconductor van der Waals Heterostructures" was published by researchers at Chalmers University of Technology. Abstract "Two-dimensional (2D) transition metal dichalcogenides (TMDs) have received significant interest for use in tunnel field-effect transistors (TFETs) due to their ultrathin layers... » read more

Analog Accelerator For AI/ML Training Workloads Using Stochastic Gradient Descent (Imperial College London)
By Technical Paper Link - 24 Jan, 2025 - Comments: 0

A new technical paper titled "Learning in Log-Domain: Subthreshold Analog AI Accelerator Based on Stochastic Gradient Descent" was published by researchers at Imperial College London. Abstract "The rapid proliferation of AI models, coupled with growing demand for edge deployment, necessitates the development of AI hardware that is both high-performance and energy-efficient. In this paper, w... » read more

New Class Of Memory: Managed-Retention Memory or MRM (Microsoft Research)
By Technical Paper Link - 22 Jan, 2025 - Comments: 0

A new technical paper titled "Managed-Retention Memory: A New Class of Memory for the AI Era" was published by researchers at Microsoft. Abstract "AI clusters today are one of the major uses of High Bandwidth Memory (HBM). However, HBM is suboptimal for AI workloads for several reasons. Analysis shows HBM is overprovisioned on write performance, but underprovisioned on density and read band... » read more

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures" was published by researchers at University of Stuttgart, IIT Kanpur, National Yang Ming Chiao Tung University, Khalifa University, and TU Munich. Abstract "Complementary metal–oxide–semiconductor (CMOS)-based computing promises drastic improvement in performance at extremely low temp... » read more

Liquid-Infused Nanostructured Composites As A Universal Thermal Interface Solution for Cooling Applications
By Technical Paper Link - 20 Jan, 2025 - Comments: 0

A new technical paper titled "Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling" was published by researchers at Carnegie Mellon University, Oregon State University and Arieca. Abstract "Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inev... » read more

Design-Space Analysis of M3D FPGA With BEOL Configuration Memories (Georgia Tech, UCLA)
By Technical Paper Link - 17 Jan, 2025 - Comments: 0

A new technical paper titled "Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories" was published by researchers at Georgia Tech and UCLA. Abstract "This work presents a novel monolithic 3D (M3D) FPGA architecture that leverages stackable back-end-of-line (BEOL) transistors to implement configuration memory and pass gates, significantly improving area, latency, and power ef... » read more

Design Space for the Device-Circuit Codesign of NVM-Based CIM Accelerators (TSMC)
By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new technical paper/mini-review titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by researchers at TSMC and National Tsing Hua University. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devi... » read more

Transformation Of Polarons As Tellurene Becomes Thinner
By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new research paper titled "Thickness-dependent polaron crossover in tellurene" was published by researchers from Rice University, Lawrence Berkeley National Laboratory, MIT, Argonne National Laboratory, ORNL, Purdue University, and Stanford University. Abstract "Polarons, quasiparticles from electron-phonon coupling, are crucial for material properties including high-temperature supercond... » read more

AI Accelerators for Homomorphic Encryption Workloads
By Technical Paper Link - 15 Jan, 2025 - Comments: 0

A new technical paper titled "Leveraging ASIC AI Chips for Homomorphic Encryption" was published by researchers at Georgia Tech, MIT, Google and Cornell University. Abstract: "Cloud-based services are making the outsourcing of sensitive client data increasingly common. Although homomorphic encryption (HE) offers strong privacy guarantee, it requires substantially more resources than compu... » read more

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