category: Test, Measurement & Analytics

category: IoT, Security & Automotive

Designing Hardware Accelerators Using A Data-Driven Approach
By Technical Paper Link - 21 Jun, 2022 - Comments: 0

Research paper titled "Data-Driven Offline Optimization For Architecting Hardware Accelerators" by researchers at Google Research and UC Berkeley. Abstract "Industry has gradually moved towards application-specific hardware accelerators in order to attain higher efficiency. While such a paradigm shift is already starting to show promising results, designers need to spend considerable man... » read more

Finding Wafer Defects Using Quantum DL
By Technical Paper Link - 13 Jun, 2022 - Comments: 0

New research paper titled "Semiconductor Defect Detection by Hybrid Classical-Quantum Deep Learning" by researchers at National Tsing Hua University. Abstract "With the rapid development of artificial intelligence and autonomous driving technology, the demand for semiconductors is projected to rise substantially. However, the massive expansion of semiconductor manufacturing and the develo... » read more

High-throughput LHSI Reflectometry Technique For ICU and IWU Measurements of Semiconductor Devices
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology," from researchers at Samsung Electronics Co. Abstract "Background: High-throughput three-dimensional metrology techniques for monitoring in-wafer uniformity (IWU) and in-cell uniformity (ICU) are critical for enhancing the yield of modern semiconductor manu... » read more

Artificial intelligence deep learning for 3D IC reliability prediction
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

A Novel ISO 26262-Compliant Test Bench to Assess the Diagnostic Coverage of Software Hardening Techniques against Digital Components Random Hardware Failures
By Technical Paper Link - 18 Apr, 2022 - Comments: 0

Abstract "This paper describes a novel approach to assess detection mechanisms and their diagnostic coverage, implemented using embedded software, designed to identify random hardware failures affecting digital components. In the literature, many proposals adopting fault injection methods are available, with most of them focusing on transient faults and not considering the functional safety st... » read more

Novel Methods To Enhance Data Quality in FMEA Documents In Semiconductor Manufacturing
By Technical Paper Link - 12 Apr, 2022 - Comments: 0

New research paper from Graz University of Technology & others. Abstract "Digitalization of causal domain knowledge is crucial. Especially since the inclusion of causal domain knowledge in the data analysis processes helps to avoid biased results. To extract such knowledge, the Failure Mode Effect Analysis (FMEA) documents represent a valuable data source. Originally, FMEA documents were de... » read more

Data-driven RRAM device models using Kriging interpolation
By Technical Paper Link - 10 Apr, 2022 - Comments: 0

New technical paper from The George Washington University and NIST with support from DARPA and others. Abstract "A two-tier Kriging interpolation approach is proposed to model jump tables for resistive switches. Originally developed for mining and geostatistics, its locality of the calculation makes this approach particularly powerful for modeling electronic devices with complex behavior la... » read more

NIST Modifies & Improves Technique For Detecting Transistor Defects
By Technical Paper Link - 04 Apr, 2022 - Comments: 0

Abstract "We utilize a frequency-modulated charge pumping methodology to measure quickly and conveniently single “charge per cycle” in highly scaled Si/SiO2 metal–oxide–semiconductor field effect transistors. This is indicative of detection and manipulation of a single interface trap spin species located at the boundary between the SiO2 gate dielectric and Si substrate (almost certainl... » read more

Adaptive NN-Based Root Cause Analysis in Volume Diagnosis for Yield Improvement
By Technical Paper Link - 02 Dec, 2021 - Comments: 1

Abstract "Root Cause Analysis (RCA) is a critical technology for yield improvement in integrated circuit manufacture. Traditional RCA prefers unsupervised algorithms such as Expectation Maximization based on Bayesian models. However, these methods are severely limited by the weak predictive capability of statistical models and can’t effectively transfer the yield learning experience from old... » read more

Improving Volume Diagnosis and Debug with Test Failure Clustering and Reorganization
By Technical Paper Link - 02 Dec, 2021 - Comments: 0

Abstract: "Volume diagnosis and debug play a key role in identifying systematic test failures caused by manufacturing defectivity, design marginalities, and test overkill. However, diagnosis tools often suffer from poor diagnosis resolution. In this paper, we propose techniques to improve diagnosis resolution by test failure clustering and reorganization. The effectiveness of our techniques ... » read more

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