How Memory Design Optimizes System Performance


Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

Rethinking Machine Learning For Power


The power consumed by machine learning is exploding, and while advances are being made in reducing the power consumed by them, model sizes and training sets are increasing even faster. Even with the introduction of fabrication technology advances, specialized architectures, and the application of optimization techniques, the trend is disturbing. Couple that with the explosion in edge devices... » read more

Designing For Thermal


Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

New Data Management Challenges


An explosion in semiconductor design and manufacturing data, and the expanding use of chips in safety-critical and mission-critical applications, is prompting chipmakers to collect and manage that data more effectively in order to improve overall performance and reliability. This collection of data reveals a number of challenges with no simple solutions. Data may be siloed and inconsistent, ... » read more

Is There A Limit To The Number of Layers In 3D-NAND?


Memory vendors are racing to add more layers to 3D NAND, a competitive market driven by the explosion in data and the need for higher-capacity solid state drives and faster access time. Micron already is filling orders for 232-layer NAND, and not to be outdone, SK Hynix announced that it will begin volume manufacturing 238-layer 512Gb triple level cell (TLC) 4D NAND in the first half of next... » read more

Challenges Grow For Modeling Auto Performance, Power


Rising complexity in automobiles is creating huge challenges about how to add more safety and comfort features and electronics into vehicles without reducing the overall range they can travel or pricing them so high that only the rich can afford them. While the current focus is on modeling hardware and software to understand interactions between systems, this remains a huge challenge. It req... » read more

AI Power Consumption Exploding


Machine learning is on track to consume all the energy being supplied, a model that is costly, inefficient, and unsustainable. To a large extent, this is because the field is new, exciting, and rapidly growing. It is being designed to break new ground in terms of accuracy or capability. Today, that means bigger models and larger training sets, which require exponential increases in processin... » read more

New Uses For AI In Chips


Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Cryogenic CMOS Becomes Cool


Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

Tradeoffs In Archiving Data


If you’ve ever had to sort through old technical documents, wondering what still has value and what can be safely tossed, you can identify with the quandary of Thomas Levy, UCSD professor of anthropology and co-founder of the field of cyber-archaeology. Staring at thousands of pieces of pottery in a Jordanian dessert, he erred on the side of keeping it all. “My personal perspective when ... » read more

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