category: Top Stories

category: IoT, Security & Automotive

Defining The Chiplet Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

Developing Workflows To Streamline System-Level Design
By Ann Mutschler - 28 Aug, 2024 - Comments: 0

Experts At The Table: One of the big challenges facing EDA companies is explaining to customers what's possible, how to streamline their designs, and what can be accomplished at what level of risk. Semiconductor Engineering sat down to talk about how relationships are fundamentally changing between EDA companies and their customers Michal Siwinski, chief marketing officer at Arteris; Chris Muet... » read more

As EDA Processes Becomes More Secure, So Do Chips
By Adam Kovac - 26 Aug, 2024 - Comments: 0

Security is becoming a much bigger concern within chips and electronic systems, but the actual implementation remains something of an afterthought, which limits its effectiveness. There are many pieces to the security puzzle on the chip design side that go well beyond just securing the hardware or the IP. The EDA tools themselves need to be secure, as well, and so does the user data within t... » read more

Focus Shifts To Application-Specific Workloads
By Ann Mutschler - 07 Aug, 2024 - Comments: 0

Experts At The Table: EDA has undergone numerous workflow changes over time. Different skill sets have come into play over the years, and at times this changed the definition of what it means to design at the system level. To work out what this means for designers today, and how it looks going forward, Semiconductor Engineering sat down with Michal Siwinski, chief marketing officer at Arteris; ... » read more

Will AI Disrupt EDA?
By Brian Bailey - 25 Jul, 2024 - Comments: 1

Generative AI has disrupted search, it is transforming the computing landscape, and now it's threatening to disrupt EDA. But despite the buzz and the broad pronouncements of radical changes ahead, it remains unclear where it will have impact and how deep any changes will be. EDA has two primary roles — automation and optimization. Many of the optimization problems are NP hard, which means ... » read more

Floor-Planning Evolves Into The Chiplet Era
By Karen Heyman - 25 Jul, 2024 - Comments: 0

3D-ICs and heterogeneous chiplets will require significant changes in physical layout tools, where the placement of chiplets and routing of signals can have a big impact on overall system performance and reliability. EDA vendors are well aware of the issues and working on solutions. Top on the list of challenges for 3D-ICs is thermal dissipation. Logic typically generates the most heat, and ... » read more

What’s Next In System-Level Design?
By Ann Mutschler - 25 Jul, 2024 - Comments: 0

Experts At The Table: EDA has undergone numerous workflow changes over time. Different skill sets have come into play over the years, and at times this changed the definition of what it means to design at the system level. Semiconductor Engineering sat down to discuss what this means for designers today, and what the impact will be in the future, with Michal Siwinski, chief marketing officer at... » read more

Verification Tools Straining To Keep Up
By Brian Bailey - 01 Jul, 2024 - Comments: 0

Verification engineers are the unsung heroes of the semiconductor industry, but they are at a breaking point and desperately in need of modern tools and flows to deal with the rapidly increasing pressures. Verification is no longer just about ensuring that functionality is faithfully represented in an implementation. That alone is an insolvable task, but verification has taken on many new re... » read more

Digital Twins Gaining Traction In Complex Designs
By Ann Mutschler - 27 Jun, 2024 - Comments: 0

The integration of heterogeneous chiplets into an advanced package, coupled with the increasing digitalization of multiple industry segments, is pushing digital twins to the forefront of design. The challenge in these complex assemblies is figuring out the potential tradeoffs between different chiplets, different assembly approaches, and to be able to do it quickly enough to still hit market... » read more

Data Coherence Across Silos And Hierarchy
By Brian Bailey - 27 Jun, 2024 - Comments: 0

Shift left has become a rallying cry for the chip design industry, but unless coherent data can flow between the groups being impacted, the value may not be as great as expected. Shift left is a term that encompasses attempts to bring analysis and decision-making forward in the development process. The earlier an issue can be found, the less of a problem it ultimately becomes. But in many ca... » read more

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