Industry Pressure Grows For Simulating Systems Of Systems

By Brian Bailey - 28 Sep, 2023 - Comments: 0

Most complex systems are designed in a top-down manner, but as the amount of electronic content in those systems increases, so does the pressure on the chip industry to provide high-level models and simulation capabilities. Those models either do not exist today, or they exist in isolation. No matter how capable a model or simulator, there never will be one that can do it all. In some cases,... » read more

AI Drives Need For Optical Interconnects In Data Centers

By Karen Heyman - 28 Sep, 2023 - Comments: 0

An explosion of data, driven by more sensors everywhere and the inclusion of AI/ML in just about everything, is ratcheting up the pressure on data centers to leverage optical interconnects to speed up data throughput and reduce latency. Optical communication has been in use for several decades, starting with long-haul communications, and evolving from there to connect external storage to ser... » read more

What Happened To Portable Stimulus?

By Brian Bailey - 28 Sep, 2023 - Comments: 0

In June 2018, Accellera released the initial version of the Portable Test and Stimulus Standard (PSS), a new verification language that was slated to be the first new abstraction defined within EDA for a couple of decades. So what happened to it? Apart from a few updates at DVCon, there appears to be little talk about it today. However, the industry has its head down trying to make it work, ... » read more

Data Management Challenges In Heterogeneous Systems

By Ed Sperling - 27 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management, chiplets, and standards, with Mujtaba Hamid, general manager for product management for secure cloud environments at Microsoft; Vijaykishan Narayanan, vice president and general manager of India engineering and operations at proteanTecs; KT Moore, vice presiden... » read more

ReRAM Seeks To Replace NOR

By Karen Heyman - 25 Sep, 2023 - Comments: 0

Resistive RAM is gaining renewed attention as demand for faster and cheaper non-volatile memory alternatives continues to grow, particularly in applications such as automotive. Embedded flash has long left designers wishing for better write speeds and lower energy consumption, but as the leading edge of that technology shrunk to 28nm, another problem arose. Manufacturing flash memory at thos... » read more

Building Better Bridges In Advanced Packaging

By Laura Peters - 21 Sep, 2023 - Comments: 1

The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew of new options, it also is causing widespread confusion over what works best for different processes and technologies. At its core, advanced packaging depends on reliable interconnects, well-def... » read more

When And Where To Implement AI/ML In Fabs

By Anne Meixner - 21 Sep, 2023 - Comments: 0

Deciphering complex interactions between variables is where machine learning and deep learning shine, but figuring out exactly how ML-based systems will be most useful is the job of engineers. The challenge is in pairing their domain expertise with available ML tools to maximize the value of both. This depends on sufficient quantities of good data, highly optimized algorithms, and proper tra... » read more

Ferroelectric Memories Answer Call For Non-Volatile Alternatives

By Katherine Derbyshire - 21 Sep, 2023 - Comments: 0

As system designers seek to manipulate larger data sets while reducing power consumption, ferroelectric memory may be part of the solution. It offers an intermediate step between the speed of DRAM and the stability of flash memory. Changing the polarization of ferroelectric domains is extremely fast, and the polarization remains stable without power for years, if not decades. FeFETs, one of ... » read more

Why Chiplets Don’t Work For All Designs

By Ed Sperling - 20 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Quantum Plus AI Widens Cyberattack Threat Concerns

By John Koon - 18 Sep, 2023 - Comments: 1

Quantum computing promises revolutionary changes to the computing paradigm that the semiconductor industry has operated under for decades, but it also raises the prospect of widespread cybersecurity threats. Quantum computing cyberattacks will occur millions of times faster than any assault conventional computing can muster. And while quantum computing is in an early stage of development, ex... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.