How Metrology Tools Stack Up In 3D NAND Devices


Multiple innovations in semiconductor processing are needed to enable 3D NAND bit density increases of about 30% per year at ever-decreasing cost per bit, all of which will be required to meet the nonvolatile storage needs of the big data era. 3D NAND is the first truly three-dimensional device in production. It is both a technology driver for new metrology methods and a significant part of ... » read more

Holistic Power Reduction


The power consumption of a device is influenced by every stage of the design, development, and implementation process, but identifying opportunities to save power no longer can be just about making hardware more efficient. Tools and methodologies are in place for most of the power-saving opportunities, from RTL down through implementation, and portions of the semiconductor industry already a... » read more

Making Tradeoffs With AI/ML/DL


Machine learning, deep learning, and AI increasingly are being used in chip design, and they are being used to design chips that are optimized for ML/DL/AI. The challenge is understanding the tradeoffs on both sides, both of which are becoming increasingly complex and intertwined. On the design side, machine learning has been viewed as just another tool in the design team's toolbox. That's s... » read more

Rethinking Engineering Education In The U.S.


The CHIPS Act, as well as the ongoing need for talent, is causing both industry and academia in America to rethink engineering education, resulting in new approaches and stronger partnerships. As an example, Arizona State University (ASU) now has a Secure, Trusted, and Assured Microelectronics Center (STAM). The center offers an interdisciplinary approach to learning secure and trusted semic... » read more

Designing Crash-Proof Autonomous Vehicles


Autonomous vehicles keep crashing into things, even though ADAS technology promises to make driving safer because machines can think and react faster than human drivers. Humans rely on seeing and hearing to assess driving conditions. When drivers detect objects in front of the vehicle, the automatic reaction is to slam on the brakes or swerve to avoid them. Quite often drivers cannot react q... » read more

Pinpointing Timing Delays Can Improve Chip Reliability


Growing pressure to improve IC reliability in safety- and mission-critical applications is fueling demand for custom automated test pattern generation (ATPG) to detect small timing delays, and for chip telemetry circuits that can assess timing margin over a chip's lifetime. Knowing the timing margin in signal paths has become an essential component in that reliability. Timing relationships a... » read more

3D Structures Challenge Wire Bond Inspection


Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer applications, where the majority of chips are not de... » read more

Optimizing Scan Test For Complex ICs


As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin availability. In addition, the complexity of emerging packages like 3D and chiplets necessitates comprehensive new solutions that can provide faster results at multiple stages in the silicon lifec... » read more

ML Automotive Chip Design Takes Off


Machine learning is increasingly being deployed across a wide swath of chips and electronics in automobiles, both for improving reliability of standard parts and for the creation of extremely complex AI chips used in increasingly autonomous applications. On the design side, the majority of EDA tools today rely on reinforcement learning, a machine learning subset of AI that teaches a machine ... » read more

Data Leakage Becoming Bigger Issue For Chipmakers


Data leakage is becoming more difficult to stop or even trace as chips become increasingly complex and heterogeneous, and as more data is stored and utilized by chipmakers for other designs. Unlike a cyberattack, which typically is done for a specific purpose, such as collecting private data or holding a system ransom, data leaks can spring up anywhere. And as the value of data increases, th... » read more

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