Making Sense Of DRAM


Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Hybrid Memory


Gary Bronner, senior vice president of Rambus Labs, talks about the future of DRAM scaling, why one type of memory won’t solve all needs, and what the pros and cons are of different memories. https://youtu.be/R0hhDx2Fb7Q » read more

Huge Performance Gains Ahead


Rambus Chief Scientist Craig Hampel talks about what will drive the next big performance gains after Moore’s Law, from the data center to the edge. https://youtu.be/ItHCsei7YTc » read more

UPF-Aware Clock-Domain Crossing


Synopsys’ Namit Gupta talks with Semiconductor Engineering about low-power design techniques at the most advanced process nodes, including how to verify the impact of CDC on power at the register transfer level, how to avoid bugs caused by the post-RTL insertion of low-power devices such as isolation, retention and level shifters. https://youtu.be/HwRe9DHLfmg » read more

Aging Effects


Tech Talk: Fraunhofer EAS' group manager for quality and reliability, Andre Lange, talks about how to model aging effects and why the problems are becoming more difficult at advanced nodes. https://youtu.be/XHWww2PE7aY » read more

In-Design Power Rail Analysis


Tech Talk: Kenneth Chang, senior staff product marketing manager at Synopsys, talks about what can go wrong with power at advanced nodes and why in-design power rail analysis works best early in the flow in helping to reduce overall margin. https://youtu.be/0oiWQPS1-Xk » read more

Tech Talk: Data-Driven Design


Steven Woo, distinguished inventor at Rambus, talks about memory hierarchies and how they are changing as the amount of data continues to grow. https://youtu.be/4FwZ1YeQa18 » read more

Tech Talk: HBM vs. GDDR6


Frank Ferro, senior director of product management at Rambus, talks about memory bottlenecks and why both GDDR6 and high-bandwidth memory are gaining steam and for which markets. https://youtu.be/CPqdZZooS2g » read more

Tech Talk: Shrink Vs. Package


Andy Heinig, group manager for system integration at Fraunhofer EAS, talks about the tradeoffs between planar design and advanced packaging, including different types of interposers, chiplets and thermal issues. https://youtu.be/1BDqgCujJno » read more

Tech Talk: Analog Simplified


Benjamin Prautsch, Fraunhofer EAS' group manager for advanced mixed-signal automation, talks about how to simplify and speed up analog IP development, its role in IoT and IIoT/Industry 4.0, and why this is becoming so important for advanced packaging and advanced process nodes. https://youtu.be/6ISL1A7Wy_I » read more

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