Tech Talk: eFPGA Acceleration

By Ed Sperling - 03 May, 2017 - Comments: 0

Achronix's Kent Orthner talks about when and why to use embedded FPGAs, and how they co-exist with—and compare to—other processing elements. [youtube vid=TXeIOmo7O9o] » read more

Tech Talk: Ethernet

By Ed Sperling - 13 Mar, 2017 - Comments: 0

George Hervey, principal architect at Marvell, talks about the power efficiency of networking in the enterprise and how much money can be saved by rightsizing Ethernet equipment. [youtube vid=PxDR94UOFaM] Related Stories Executive Insight: Sehat Sutardja Marvell’s CEO talks about the rising cost of design and why new packaging approaches are essential. » read more

Tech Talk: Extending DRAM

By Ed Sperling - 09 Jan, 2017 - Comments: 0

Bruce Bateman, senior principal engineer at Kilopass, talks about how to extend the life of DRAM and how to work with smaller, denser memory. Related Stories Executive Insight: Charlie Cheng Kilopass’ CEO talks about how to cut the capacitor in DRAM and why that’s important in the data center. » read more

Tech Talk: Configurable Logic

By Ed Sperling - 08 Oct, 2015 - Comments: 0

Cliff Lloyd, business development director at NXP Semiconductors, talks about designing in one part for many functions to reduce power consumption and cost. [youtube vid=ut5kCm0kNwE] » read more

Tech Talk: Sensor Design

By Ed Sperling - 03 Sep, 2015 - Comments: 0

NXP's Wouter Sijm talks about sensor design in the IoT age, where engineers can go astray, and why the IoT is a more complex environment for sensors than previous devices. [youtube vid=7fqEatgvZnE] » read more

Tech Talk: Mesh Networks

By Ed Sperling - 06 Jul, 2015 - Comments: 0

Yifeng Zhang, director of systems at NXP, discusses problems in connecting home networks and how that's about to change with Bluetooth Low Energy and mesh networking approaches. [youtube vid=zcET06J2Z2k] » read more

Tech Talk: Mobile Security (Part 2)

By Ed Sperling - 15 Apr, 2015 - Comments: 0

Simon Blake Wilson of Rambus' Cryptography Research Division talks about where security needs to fit into the design flow and where the biggest risks are. To view part one of this video, click here. [youtube vid=_nnniakpP3M] » read more

Tech Talk: Swarm Boxes

By Ed Sperling - 18 Mar, 2015 - Comments: 0

Edward Lee, distinguished professor of electrical engineering and computer science at UC Berkeley, shows off a prototype of a new class of IoT devices that fit into a category dubbed immobiles, and introduces a more meaningful terminology for the IoT: The Internet of Important Things. [youtube vid=4QLRfJ-fQKg] » read more

Tech Talk: Mobile Security (Part 1)

By Ed Sperling - 17 Mar, 2015 - Comments: 0

Simon Blake-Wilson, of Rambus' Cryptography Research Division, talks with Semiconductor Engineering about mobile security and how the risk will escalate with the IoT in banking, data centers, entertainment and devices themselves. [youtube vid=EJ75T-SEp4U] » read more

Tech Talk: The Enigma Machine

By Ed Sperling - 09 Mar, 2015 - Comments: 0

Paul Kocher, president of Rambus' Cryptography Research Division, shows off the famed World War II cypher device—the same machine used in the movie "The Imitation Game", and explains how and why the supposedly unbreakable code was cracked, and why that applies to current day security. [youtube vid=aKvpcUefok8] » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

category: Videos

category: IoT, Security & Automotive