category: Videos

category: IoT, Security & Automotive

1.6 Tb/s Ethernet Challenges
By Ed Sperling - 16 Nov, 2021 - Comments: 0

Moving data at blazing fast speeds sounds good in theory, but it raises a number of design challenges. John Swanson, senior product marketing manager for high-performance computing digital IP at Synopsys, talks about the impact of next-generation Ethernet on switches, the types of data that need to be considered, the causes of data growth, and the size and structure of data centers, both in the... » read more

Total Critical Area For Optimizing Test Patterns
By Ed Sperling - 19 Oct, 2021 - Comments: 0

Increasing complexity at advanced nodes makes it much harder to locate defects and latent defects because there is more surface area to cover and much less space between the various components in a leading-edge chip design. Ron Press, technology enablement director at Siemens Digital Industries Software, talks about why it’s so important to predict where defects are most likely to occur in th... » read more

Growing Challenges With Wafer Bump Inspection
By Ed Sperling - 11 Oct, 2021 - Comments: 1

As advanced packaging goes mainstream, ensuring that wafer bumps are consistent has emerged as a critical concern for foundries and OSATs. John Hoffman, computer vision engineering manager at CyberOptics, talks about the shift toward middle-of-line and how that is affecting inspection and metrology, why there is so much concern over co-planarity and alignment, how variation can add up and creat... » read more

Open Cavity Plastic Packaging
By Ed Sperling - 30 Sep, 2021 - Comments: 0

Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets a... » read more

Optimizing AI Systems
By Ed Sperling - 29 Sep, 2021 - Comments: 0

Inserting AI and machine learning into chips adds a whole new dimension of complexity, and creates a variety of potential problems, including deadlocks, loss of performance, and difficulty in achieving closure on many fronts. Gajinder Panesar, fellow at Siemens EDA, talks with Semiconductor Engineering about what’s changed and how to optimize these new devices and systems by monitoring them f... » read more

Low-Power Always-On Circuits
By Ed Sperling - 27 Sep, 2021 - Comments: 0

Some circuits are always on. A smart phone wakes up when it senses a user, and a smart speaker responds to keywords. The challenge is to make sure these devices don’t consume a lot of power while the rest of a device is powered down, that it remains secure, and that it can quickly wake up whatever other functions are needed. All of this requires a significant amount of engineering work. Amol ... » read more

Using ML In EDA
By Ed Sperling - 20 Sep, 2021 - Comments: 0

Machine learning is becoming essential for designing chips due to the growing volume of data stemming from increasing density and complexity. Nick Ni, director of product marketing for AI at Xilinx, examines why machine learning is gaining traction at advanced nodes, where it’s being used today and how it will be used in the future, how quality of results compare with and without ML, and what... » read more

What’s Changing In DRAM
By Ed Sperling - 15 Sep, 2021 - Comments: 0

Most of the attention in chip scaling has been focused on logic and on-chip memory, but off-chip memory is starting to encounter problems, as well. David Fried, vice president of computational products at Lam Research, looks at the impact of shrinking features and increasing density, including variation, thermal effects and aging, as well as effects such as micro-loading and DRAM stacking. » read more

Working With RISC-V
By Ed Sperling - 17 Aug, 2021 - Comments: 0

RISC-V is coming on strong, but working with this open-source processor core isn't as simple as plugging in a commercial piece of IP. Zdenek Prikryl, CTO at Codasip, talks about utilizing hypervisors and open source tools and extensions to the RISC-V instruction set architecture, where design teams can run into problems, what will change as the architecture becomes more mature, the difference b... » read more

Changes In Auto Architectures
By Ed Sperling - 04 Aug, 2021 - Comments: 0

Automotive architectures are changing from a driver-centric model to one where technology supplements and in some cases replaces the driver. Hans Adlkofer, senior vice president and head of the Automotive Systems Group at Infineon, looks at the different levels of automation in a vehicle, what’s involved in the shift from domain to zonal architectures, why a mix of processors will be required... » read more

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