How to improve security in automotive software.
Automotive product design is rapidly evolving and the magnitude and pace of change facing engineering organizations is challenging incumbent processes and resources, especially in the area of software design. While connected cars are not new, the frequency and depth to which the industry is embracing this dynamic is accelerating. Software has emerged as a primary vehicle for innovation and differentiation among makes and models of cars.
This white paper from VDC Research discusses the changes that systems integrators, OEMs, and/or dealers can adopt to augment security at the device level. To read more, click here.
Steps are being taken to minimize problems, but they will take years to implement.
But that doesn’t mean it’s going to be mainstream anytime soon.
Companies are speeding ahead to identify the most production-worthy processes for 3D chip stacking.
New capacity planned for 2024, but production will depend on equipment availability.
Number of options is growing, but so is the list of tradeoffs.
Increased transistor density and utilization are creating memory performance issues.
Suppliers are investing new 300mm capacity, but it’s probably not enough. And despite burgeoning 200mm demand, only Okmetic and new players in China are adding capacity.
The industry reached an inflection point where analog is getting a fresh look, but digital will not cede ground readily.
100% inspection, more data, and traceability will reduce assembly defects plaguing automotive customer returns.
Engineers are finding ways to effectively thermally dissipate heat from complex modules.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Steps are being taken to minimize problems, but they will take years to implement.
Disaggregation and the wind-down of Moore’s Law have changed everything.
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