Challenges of performing dynamic characterization on a bare chip, as well as technologies to help.
Power semiconductor devices are used in a variety of forms, such as being packaged in Surface Mount Devices (SMDs) or power modules, and they find broad applications. Power semiconductor bare chips are loaded into these packages. It is desirable to characterize the bare chip before placing it in a package or a power module to expedite development. However, the small size, fragile structure, and parasitic effects caused by probing create multiple challenges for dynamically characterizing these power semiconductor bare chips. This article reviews the challenges of performing dynamic characterization on a bare chip, as well as some new technologies that help address these challenges.
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