Maximize performance in the thermal envelope.
The modern System-on-Chip (SoC) has higher thermal dissipation than its previous generations, because of the following factors:
Faster frequencies mean faster switching, which means more power consumption and more heat dissipation. Smaller size means smaller thermal mass, which makes it more difficult to transfer heat quickly. As a result, power density has increased rapidly, and SoC temperature has now become a fundamental design bottleneck. Therefore, you need a thermal management solution to keep an SoC within a defined temperature range.
Most ARM-based systems do not have fans. Therefore, you must take special care to keep system temperatures within acceptable bounds.
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